-
1
-
-
0020127035
-
Silicon as a mechanical material
-
K.E. Petersen, Silicon as a mechanical material, Proc. IEEE 70 (1982) 420-457.
-
(1982)
Proc. IEEE
, vol.70
, pp. 420-457
-
-
Petersen, K.E.1
-
2
-
-
36549104881
-
Fracture testing of silicon microelements in-situ in a scanning electron microscope
-
S. Johansson, J. A. Schweitz, L. Tenerz, J. Tiren, Fracture testing of silicon microelements in-situ in a scanning electron microscope, J. Appl. Phys. 63 (1988) 4799-4803.
-
(1988)
J. Appl. Phys.
, vol.63
, pp. 4799-4803
-
-
Johansson, S.1
Schweitz, J.A.2
Tenerz, L.3
Tiren, J.4
-
3
-
-
0000416997
-
Micromechanical fracture strength of silicon
-
F. Ericson, J.A. Schweitz, Micromechanical fracture strength of silicon, J. Appl. Phys. 68 (1990) 5840-5844.
-
(1990)
J. Appl. Phys.
, vol.68
, pp. 5840-5844
-
-
Ericson, F.1
Schweitz, J.A.2
-
4
-
-
0000195904
-
Fracture testing of bulk silicon microcantilever beams
-
C.J. Wilson, A. Ormeggi, M. Narbutovskih, Fracture testing of bulk silicon microcantilever beams, J. Appl. Phys. 79 (1996) 2386-2393.
-
(1996)
J. Appl. Phys.
, vol.79
, pp. 2386-2393
-
-
Wilson, C.J.1
Ormeggi, A.2
Narbutovskih, M.3
-
5
-
-
0030246332
-
Fracture testing of bulk silicon micro-cantilever beams subjected to a side load
-
C.J. Wilson, P.A. Beck, Fracture testing of bulk silicon micro-cantilever beams subjected to a side load, J. Microelectromech. Syst. 5 (1996) 142-150.
-
(1996)
J. Microelectromech. Syst.
, vol.5
, pp. 142-150
-
-
Wilson, C.J.1
Beck, P.A.2
-
6
-
-
0031236953
-
A new technique for measuring the mechanical properties of thin films
-
W.N. Sharpe, Jr., B. Yuan, R.L. Edwards, A new technique for measuring the mechanical properties of thin films, J. Microelectromech. Syst. 6 (1997) 193-199.
-
(1997)
J. Microelectromech. Syst.
, vol.6
, pp. 193-199
-
-
Sharpe W.N., Jr.1
Yuan, B.2
Edwards, R.L.3
-
7
-
-
0042638058
-
Tensile testing of silicon film having different crystallographic orientations carried out on a silicon chip
-
K. Sato, T. Yoshioka, T. Anso, M. Shikida, T. Kawabata, Tensile testing of silicon film having different crystallographic orientations carried out on a silicon chip, Sens. Actuat. A 70 (1998) 148-152.
-
(1998)
Sens. Actuat. A
, vol.70
, pp. 148-152
-
-
Sato, K.1
Yoshioka, T.2
Anso, T.3
Shikida, M.4
Kawabata, T.5
-
8
-
-
0002193058
-
Mechanical characterization of thick polysilicon films: Young's modulus and fracture strength evaluated with microstructures
-
S. Greek, F. Ericson, S. Johansson, M. Furtsch, A. Rump, Mechanical characterization of thick polysilicon films: Young's modulus and fracture strength evaluated with microstructures, J. Micromech. Microeng. 9 (1999) 245-251.
-
(1999)
J. Micromech. Microeng.
, vol.9
, pp. 245-251
-
-
Greek, S.1
Ericson, F.2
Johansson, S.3
Furtsch, M.4
Rump, A.5
-
10
-
-
0042760419
-
Measurement of mechanical resonance and losses in nanometer scale silicon wires
-
D.W. Carr, S. Evoy, L. Sekaric, H.G. Craighead, J.M. Parpia, Measurement of mechanical resonance and losses in nanometer scale silicon wires, Appl. Phys. Lett. 75 (1999) 920-922.
-
(1999)
Appl. Phys. Lett.
, vol.75
, pp. 920-922
-
-
Carr, D.W.1
Evoy, S.2
Sekaric, L.3
Craighead, H.G.4
Parpia, J.M.5
-
11
-
-
0001352045
-
Monocrystalline silicon carbide nanoelectromechanical systems
-
Y.T. Yang, K.L. Ekinci, X.M.H. Huang, L.M. Schiavone, M.L. Roukes, C.A. Zorman, M. Mehregany, Monocrystalline silicon carbide nanoelectromechanical systems, Appl. Phys. Lett. 78 (2001) 162-164.
-
(2001)
Appl. Phys. Lett.
, vol.78
, pp. 162-164
-
-
Yang, Y.T.1
Ekinci, K.L.2
Huang, X.M.H.3
Schiavone, L.M.4
Roukes, M.L.5
Zorman, C.A.6
Mehregany, M.7
-
13
-
-
0034468211
-
Evaluation of size effect on mechanical properties of single-crystal silicon by nanoscale bending test using AFM
-
T. Namazu, Y. Isono, T. Tanaka, Evaluation of size effect on mechanical properties of single-crystal silicon by nanoscale bending test using AFM, J. Microelectromech. Syst. 9 (2000) 450-459.
-
(2000)
J. Microelectromech. Syst.
, vol.9
, pp. 450-459
-
-
Namazu, T.1
Isono, Y.2
Tanaka, T.3
-
14
-
-
0001488961
-
Fabrication of Si nanostructures with an atomic force microscope
-
E.S. Snow, P.M. Campbell, Fabrication of Si nanostructures with an atomic force microscope, Appl. Phys. Lett. 64 (1994) 1932-1934.
-
(1994)
Appl. Phys. Lett.
, vol.64
, pp. 1932-1934
-
-
Snow, E.S.1
Campbell, P.M.2
-
15
-
-
84967850158
-
Fabrication of nanometer-scale structures using atomic force microscopy with conducting probe
-
T. Hattori, Y. Eijiri, K. Sato, Fabrication of nanometer-scale structures using atomic force microscopy with conducting probe, J. Vac. Sci. Technol. A 12 (1994) 2586-2590.
-
(1994)
J. Vac. Sci. Technol. A
, vol.12
, pp. 2586-2590
-
-
Hattori, T.1
Eijiri, Y.2
Sato, K.3
-
16
-
-
0026898739
-
Anisotropic etching of silicon in TMAH solutions
-
O. Tabata, R. Asahi, H. Funabishi, K. Shimaoka, S. Sugiyama, Anisotropic etching of silicon in TMAH solutions, Sens. Actuat. A 34 (1992) 51-57.
-
(1992)
Sens. Actuat. A
, vol.34
, pp. 51-57
-
-
Tabata, O.1
Asahi, R.2
Funabishi, H.3
Shimaoka, K.4
Sugiyama, S.5
-
18
-
-
0000117873
-
Mechanical and tribological properties of silicon for micromechanical applications: A review
-
B. Bhushan, S. Venkatesan, Mechanical and tribological properties of silicon for micromechanical applications: a review, Adv. Inform. Storage Syst. 5 (1993) 211-239.
-
(1993)
Adv. Inform. Storage Syst.
, vol.5
, pp. 211-239
-
-
Bhushan, B.1
Venkatesan, S.2
-
19
-
-
0003597024
-
-
INSPEC, Institution of Electrical Engineers, London
-
Anonymous, Properties of Silicon, EMIS Data Reviews Series No. 4, INSPEC, Institution of Electrical Engineers, London, 1988.
-
(1988)
Properties of Silicon, EMIS Data Reviews Series
, Issue.4
-
-
-
20
-
-
0003558311
-
-
McGraw-Hill, New York
-
B. Bhushan, B.K. Gupta, Handbook of Tribology: Materials, Coatings and Surface Treatments, McGraw-Hill, New York, 1991.
-
(1991)
Handbook of Tribology: Materials, Coatings and Surface Treatments
-
-
Bhushan, B.1
Gupta, B.K.2
-
21
-
-
0000318788
-
Influence of surface-coatings on elasticity, residual-stresses, and fracture properties of silicon microelements
-
S. Johansson, F. Ericson, J.A. Schweitz, Influence of surface-coatings on elasticity, residual-stresses, and fracture properties of silicon microelements, J. Appl. Phys. 65 (1989) 122-128.
-
(1989)
J. Appl. Phys.
, vol.65
, pp. 122-128
-
-
Johansson, S.1
Ericson, F.2
Schweitz, J.A.3
-
22
-
-
0031125510
-
The fracture toughness of polysilicon microdevices: A first report
-
R. Ballarini, R.L. Mullen, Y. Yin, H. Kahn, S. Stemmer, A.H. Heuer, The fracture toughness of polysilicon microdevices: a first report, J. Mater. Res. 12 (1997) 915-922.
-
(1997)
J. Mater. Res.
, vol.12
, pp. 915-922
-
-
Ballarini, R.1
Mullen, R.L.2
Yin, Y.3
Kahn, H.4
Stemmer, S.5
Heuer, A.H.6
-
23
-
-
33746470278
-
Electrostatically actuated failure of microfabricated polysilicon fracture mechanics specimens
-
H. Kahn, R. Ballarini, R.L. Mullen, A.H. Heuer, Electrostatically actuated failure of microfabricated polysilicon fracture mechanics specimens, Proc. Roy. Soc. Lond. A 455 (1999) 3807-3823.
-
(1999)
Proc. Roy. Soc. Lond. A
, vol.455
, pp. 3807-3823
-
-
Kahn, H.1
Ballarini, R.2
Mullen, R.L.3
Heuer, A.H.4
-
24
-
-
0033749884
-
Fracture toughness and crack growth phenomena of plasma-etched single crystal silicon
-
A.M. Fitzgerald, R.H. Dauskardt, T.W. Kenny, Fracture toughness and crack growth phenomena of plasma-etched single crystal silicon. Sens. Actuat. A 83 (2000) 194-199.
-
(2000)
Sens. Actuat. A
, vol.83
, pp. 194-199
-
-
Fitzgerald, A.M.1
Dauskardt, R.H.2
Kenny, T.W.3
-
26
-
-
0003687445
-
-
Wiley, New York
-
R.W. Hertzberg, Deformation and Fracture Mechanics of Engineering Materials, third ed., Wiley, New York, 1989, pp. 277-278.
-
(1989)
Deformation and Fracture Mechanics of Engineering Materials, Third Ed.
, pp. 277-278
-
-
Hertzberg, R.W.1
-
27
-
-
0033115191
-
An integrated CMOS micromechanical resonator high-Q oscillator
-
C.T.C. Nguyen, R.T. Howe, An integrated CMOS micromechanical resonator high-Q oscillator, IEEE J Solid-St. Circ. 34 (1999) 440-455.
-
(1999)
IEEE J Solid-St. Circ.
, vol.34
, pp. 440-455
-
-
Nguyen, C.T.C.1
Howe, R.T.2
-
28
-
-
0027610335
-
Micromechanical fatigue testing
-
J.A. Connally, S.B. Brown, Micromechanical fatigue testing, Exp. Mech. 33 (1993) 81-90.
-
(1993)
Exp. Mech.
, vol.33
, pp. 81-90
-
-
Connally, J.A.1
Brown, S.B.2
-
29
-
-
0002963356
-
Fracture and fatigue behavior of single crystal silicon microelements and nanoscopic AFM damage evaluation
-
K. Komai, K. Minoshima, S. Inoue, Fracture and fatigue behavior of single crystal silicon microelements and nanoscopic AFM damage evaluation, Microsyst. Technol. 5 (1998) 30-37.
-
(1998)
Microsyst. Technol.
, vol.5
, pp. 30-37
-
-
Komai, K.1
Minoshima, K.2
Inoue, S.3
-
30
-
-
84987266075
-
A statistical distribution of wide applicability
-
W. Weibull, A statistical distribution of wide applicability, J. Appl. Mech. 18 (1951) 293.
-
(1951)
J. Appl. Mech.
, vol.18
, pp. 293
-
-
Weibull, W.1
-
32
-
-
0033750801
-
Microscale material testing of single crystalline silicon: Process effects on surface morphology and tensile strength
-
T. Yi, L. Li, C.J. Kim, Microscale material testing of single crystalline silicon: process effects on surface morphology and tensile strength, Sens. Actuat. A 83 (2000) 172-178.
-
(2000)
Sens. Actuat. A
, vol.83
, pp. 172-178
-
-
Yi, T.1
Li, L.2
Kim, C.J.3
-
33
-
-
0032026436
-
Specimen size effect on tensile strength of surface-micromachined polycrystalline silicon thin films
-
T. Tsuchiya, O. Tabata, J. Sakata, Y. Taga, Specimen size effect on tensile strength of surface-micromachined polycrystalline silicon thin films, J. Microelectromech. Syst. 7 (1998) 106-113.
-
(1998)
J. Microelectromech. Syst.
, vol.7
, pp. 106-113
-
-
Tsuchiya, T.1
Tabata, O.2
Sakata, J.3
Taga, Y.4
|