Modeling the solid-state reaction between Sn-Pb solder and a porous substrate coating

Journal of Electronic Materials

Volumn 27, Issue 11, 1998, Pages 1177-1192

  Erickson, K L ^a   Hopkins, P L ^a   Vianco, P T ^a  

^a SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

Diffusion reaction modeling; Intermetallic compound; Intermetallic growth; Porous substrate; Solder; Solid state reaction

Indexed keywords

CODES (SYMBOLS); INTERMETALLICS; MATHEMATICAL MODELS; POROUS MATERIALS; SOLDERED JOINTS; SUBSTRATES; TIN ALLOYS;

DIFFUSION-REACTION MODELING;

SOLDERING ALLOYS;

EID: 0032208591     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-998-0067-6     Document Type: Article

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