Intermetallic morphology around Ni particles in Sn-3.5Ag solder

Soldering & Surface Mount Technology

Volumn 14, Issue 2, 2002, Pages 11-17

  Lee, J G ^a   Guo, F ^a   Subramanian, K N ^a   Lucas, J P ^a  

^a Michigan State University   (United States)

Author keywords

Intermetallics; Reflow; Solder

Indexed keywords

COOLING; EUTECTICS; HEATING; INTERMETALLICS; METALLOGRAPHIC MICROSTRUCTURE; MORPHOLOGY; NICKEL; TIN ALLOYS;

COOLING RATES; HEATING RATES; THERMAL REFLOW PROFILE; TIN SILVER ALLOYS;

SOLDERING ALLOYS;

EID: 0036063765     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910210427772     Document Type: Article

References (13)

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