Elastic properties, hardness, and indentation fracture toughness of intermetallics relevant to electronic packaging

Journal of Materials Research

Volumn 19, Issue 5, 2004, Pages 1439-1454

  Gosh, G ^a  

^a Northwestern University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; BAND STRUCTURE; DUCTILITY; ELASTIC MODULI; ELECTRONICS PACKAGING; FRACTURE TOUGHNESS; GRAIN SIZE AND SHAPE; HARDNESS; INDENTATION; MECHANICAL VARIABLES MEASUREMENT; METAL CASTING; THERMAL EFFECTS;

BRANCHING PHENOMENA; COARSE GRAINED INTERMETALLICS; PULSE ECHO TECHNIQUE; SINGLE PHASE INTERMETALLICS; SLIP BANDS; ZIG ZAG PHENOMENA;

INTERMETALLICS;

EID: 3142662740     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.2004.0193     Document Type: Article

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