The Design and Assembly of Surface-Micromachined Optical Switch for Optical Add/Drop Multiplexer Application

IEEE Transactions on Advanced Packaging

Volumn 26, Issue 3, 2003, Pages 261-267

  Lin, Yu Chen ^a   Chiou, Jin Chern ^a   Lin, Wei Ting ^a   Lin, Yung Jiun ^a   Wu, Shuen De ^b  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

^b National Science Council   (Taiwan)

Author keywords

ALD; Flip chip bonding; Micromirror; OADM; Optical switch

Indexed keywords

DIELECTRIC MATERIALS; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; OPTICAL SWITCHES;

FLIP-CHIP BONDING;

ELECTRONICS PACKAGING;

EID: 0142196096     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2003.817972     Document Type: Article

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