Microrelay packaging technology using flip-chip assembly

Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2000, Pages 265-270

  Miller, David C ^a   Zhang, Wenge ^a   Bright, Victor M ^a  

^a UNIVERSITY OF COLORADO   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEFORMATION; ELECTRIC POTENTIAL; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; HEAT TREATMENT; MATHEMATICAL MODELS; MICROMACHINING; RESIDUAL STRESSES; THERMAL EFFECTS;

MICROCONNECTORS;

MICROELECTROMECHANICAL DEVICES;

EID: 0033724566     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (17)