Thermosonic bonding of an optical transceiver based on an 8 × 8 vertical cavity surface emitting laser array

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Volumn 20, Issue 2, 1997, Pages 152-159

  McLaren, Timothy S ^a   Kang, Sa Yoon ^b   Zhang, Wenge ^a   Ju, Teh Hua ^c   Lee, Yung Cheng ^a  

^a UCB 450   (United States)

^b SAMSUNG Electronics   (South Korea)

^c SDL INC   (United States)

Author keywords

Flip chip; Multichip module assembly; Thermosonic bonding; VCSEL bonding

Indexed keywords

COMPUTER SIMULATION; END EFFECTORS; FLIP CHIP DEVICES; MULTICHIP MODULES; SEMICONDUCTOR LASERS; TRANSCEIVERS; ULTRASONIC APPLICATIONS;

ASSEMBLY FORCE; THERMOSONIC BONDING PROCESS; VERTICAL CAVITY SURFACE EMITTING LASER;

BONDING;

EID: 0031144706     PISSN: 10709894     EISSN: None     Source Type: Journal    
DOI: 10.1109/96.575567     Document Type: Article

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