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Volumn 19, Issue 15, 2003, Pages 6283-6296

Direct patterning of NiB on glass substrates using microcontact printing and electroless deposition

Author keywords

[No Author keywords available]

Indexed keywords

GLASS SUBSTRATES;

EID: 0041841489     PISSN: 07437463     EISSN: None     Source Type: Journal    
DOI: 10.1021/la034317z     Document Type: Article
Times cited : (43)

References (103)
  • 8
    • 0000070448 scopus 로고    scopus 로고
    • Schlesinger, M., Paunovic, M., Eds.; John Wiley & Sons: New York
    • Schlesinger, M. In Modern Electroplating, 4th ed.; Schlesinger, M., Paunovic, M., Eds.; John Wiley & Sons: New York, 2000; pp 667-684.
    • (2000) Modern Electroplating, 4th Ed. , pp. 667-684
    • Schlesinger, M.1
  • 68
    • 0042405451 scopus 로고    scopus 로고
    • note
    • The NiB layers deposited on EDA-Si-treated display glass substrates were usually ∼150-nm thick, contained 0.25% of B, and had a specific resistivity of 25 μΩ cm and 13 μΩ cm for the as-plated and annealed films, respectively.
  • 73
    • 0041904140 scopus 로고    scopus 로고
    • note
    • EDA-Si molecules can hydrolyze or oligomerize in solution while still being able to chemisorb to the glass surface and bind Pd/Sn colloids.
  • 75
    • 0003423037 scopus 로고
    • Finishing Publications Ltd.: Stevenage, Hertfordshire, U.K.
    • Riedel, W. Electroless Nickel Plating; Finishing Publications Ltd.: Stevenage, Hertfordshire, U.K., 1991.
    • (1991) Electroless Nickel Plating
    • Riedel, W.1
  • 78
    • 0041904139 scopus 로고    scopus 로고
    • note
    • We observed that NiB features produced with this "print & plate" method tended to detach from the glass substrate in the plating bath when the film thickness was reaching 100-150 nm.
  • 79
    • 0041403114 scopus 로고    scopus 로고
    • note
    • We used nonionic (poly(ethylene oxide) derivatives) and anionic (sodium dodecyl sulfate, SDS) surfactants at a concentration of ∼0.1% (wt) in the ink solutions containing EDA-Si.
  • 82
    • 0042906192 scopus 로고    scopus 로고
    • note
    • A 15-nm-thick layer of Au evaporated on a Si wafer was used as inker pad because EDA-Si does not react with the Au surface.
  • 90
    • 0042906194 scopus 로고    scopus 로고
    • note
    • We found that accelerating the Pd/Sn colloids on the stamp before printing was preferable over printing first the catalytic particles and then accelerating them on the substrate. Acceleration before printing promotes a fast and uniform transfer of the catalyst from the stamp to the substrate.
  • 91
    • 0042405448 scopus 로고    scopus 로고
    • note
    • Rinsing the printed substrates with the accelerator solution (10% in DI water) instead of HCl yielded Ni patterns of low quality (rough edges and holes in the plated film), The accelerator might have removed too much Sn from the colloids in this case, weakening their interaction with the EDA-Si-derivatized substrate.
  • 94
  • 95
  • 99
    • 0041904138 scopus 로고    scopus 로고
    • note
    • Increasing the concentration of ECT in the ink solution to 0.3 mM improved the blocking properties of the monolayer that was formed during printing, but the monolayer could still not suppress plating of NiB completely.
  • 101
    • 0033742531 scopus 로고    scopus 로고
    • For the fabrication of high-resolution stamps, see: Schmid,H.; Michel, B. Macromolecules 2000, 33, 3042-3049.
    • (2000) Macromolecules , vol.33 , pp. 3042-3049
    • Schmid, H.1    Michel, B.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.