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The NiB layers deposited on EDA-Si-treated display glass substrates were usually ∼150-nm thick, contained 0.25% of B, and had a specific resistivity of 25 μΩ cm and 13 μΩ cm for the as-plated and annealed films, respectively.
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Wasserman, S. R.; Tao, Y.-T.; Whitesides, G. M. Langmuir 1989, 5, 1074-1087.
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Axe, J.D.6
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note
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EDA-Si molecules can hydrolyze or oligomerize in solution while still being able to chemisorb to the glass surface and bind Pd/Sn colloids.
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75
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Riedel, W. Electroless Nickel Plating; Finishing Publications Ltd.: Stevenage, Hertfordshire, U.K., 1991.
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78
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0041904139
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note
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We observed that NiB features produced with this "print & plate" method tended to detach from the glass substrate in the plating bath when the film thickness was reaching 100-150 nm.
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79
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0041403114
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note
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We used nonionic (poly(ethylene oxide) derivatives) and anionic (sodium dodecyl sulfate, SDS) surfactants at a concentration of ∼0.1% (wt) in the ink solutions containing EDA-Si.
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Duchet, J.; Chabert, B.; Chapel, J. P.; Gérard, J. F.; Chovelon, J. M.; Jaffrezic-Renault, N. Langmuir 1997, 13, 2271-2278.
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82
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0042906192
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note
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A 15-nm-thick layer of Au evaporated on a Si wafer was used as inker pad because EDA-Si does not react with the Au surface.
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83
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90
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0042906194
-
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note
-
We found that accelerating the Pd/Sn colloids on the stamp before printing was preferable over printing first the catalytic particles and then accelerating them on the substrate. Acceleration before printing promotes a fast and uniform transfer of the catalyst from the stamp to the substrate.
-
-
-
-
91
-
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0042405448
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note
-
Rinsing the printed substrates with the accelerator solution (10% in DI water) instead of HCl yielded Ni patterns of low quality (rough edges and holes in the plated film), The accelerator might have removed too much Sn from the colloids in this case, weakening their interaction with the EDA-Si-derivatized substrate.
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92
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Xia, Y.; Qin, D.; Whitesides, G. M. Adv. Mater. 1996, 8, 1015-1017.
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Gutzeit, G. Plating 1960, 47, 63-70.
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Plating
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-
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Gutzeit, G.1
-
99
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0041904138
-
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note
-
Increasing the concentration of ECT in the ink solution to 0.3 mM improved the blocking properties of the monolayer that was formed during printing, but the monolayer could still not suppress plating of NiB completely.
-
-
-
-
100
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0029345090
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Brandow, S. L.; Dressick, W. J.; Marrian, C. R. K.; Chow, G. M.; Calvert, J. M. J. Electrochem. Soc. 1995, 142, 2233-2243.
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101
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For the fabrication of high-resolution stamps, see: Schmid,H.; Michel, B. Macromolecules 2000, 33, 3042-3049.
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Schmid, H.1
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