Reliability issues and advanced failure analysis deprocessing techniques for copper/low-k technology

Annual Proceedings - Reliability Physics (Symposium)

Volumn , Issue , 2003, Pages 536-544

  Wu, Huixian ^a   Cargo, James ^a   Peridier, Carl ^a   Serpiello, Joe ^a  

^a AGERE SYSTEMS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL MECHANICAL POLISHING; COPPER; CROSSTALK; ELECTROMIGRATION; FAILURE ANALYSIS; LOW TEMPERATURE EFFECTS; REACTIVE ION ETCHING; RELIABILITY;

DEPROCESSING;

LARGE SCALE SYSTEMS;

EID: 0038309881     PISSN: 00999512     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

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