Improvement of Si/SiO2 mask etching selectivity in the new D-RIE process

Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2001, Pages 76-79

  Ohara, J ^a   Kano, K ^a   Takeuchi, Y ^a   Otsuka, Y ^a  

^a DENSO CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; IRRADIATION; MASKS; OXYGEN; PLASMA ETCHING; PLASMAS; SEMICONDUCTING SILICON; SILICA; SPUTTER DEPOSITION;

MASK ETCHING SELECTIVITY; PLASMA IRRADIATION PROCESSES;

REACTIVE ION ETCHING;

EID: 0035013821     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)