Electrothermal CAD of power devices and circuits with fully physical time-dependent compact thermal modeling of complex nonlinear 3-D systems

IEEE Transactions on Components and Packaging Technologies

Volumn 24, Issue 4, 2001, Pages 566-590

  Batty, William ^a,b   Christoffersen, Carlos E ^a,c   Panks, Andreas J ^a,b   David, Stéphane ^b   Snowden, Christopher M ^a,b   Steer, Michael B ^a,c  

^a IEEE   (United Kingdom)

^b UNIVERSITY OF LEEDS   (United Kingdom)

^c North Carolina State University   (United States)

Author keywords

Circuits; Compact modeling; Electrothermal; Harmonic balance; MMICs; Nonlinear simulation; Power FETs; Spatial power combiners; Thermal; Transient

Indexed keywords

ELECTROTHERMAL COMPUTER AIDED DESIGN;

BOUNDARY CONDITIONS; COMPUTER AIDED DESIGN; COMPUTER SIMULATION; DISCRETE FOURIER TRANSFORMS; ELECTRIC NETWORK ANALYSIS; ELECTRONICS PACKAGING; FIELD EFFECT TRANSISTORS; GREEN'S FUNCTION; HEAT RESISTANCE; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; NONLINEAR SYSTEMS;

POWER ELECTRONICS;

EID: 0035691287     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.974944     Document Type: Article

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