A physics-based, dynamic thermal impedance model for SOI MOSFET's

IEEE Transactions on Electron Devices

Volumn 44, Issue 6, 1997, Pages 957-964

  Brodsky, Jonathan S ^a,b   Fox, Robert M ^a   Zweidinger, David T ^a   Veeraraghavan, Surya ^a  

^a University of Florida   (United States)

^b MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; COMPUTER SOFTWARE; EQUIVALENT CIRCUITS; HEAT RESISTANCE; SILICON ON INSULATOR TECHNOLOGY;

ELECTROTHERMAL SIMULATIONS; SOFTWARE PACKAGE THERMAL IMPEDANCE PRE PROCESSOR (TIPP);

MOSFET DEVICES;

EID: 0031163798     PISSN: 00189383     EISSN: None     Source Type: Journal    
DOI: 10.1109/16.585551     Document Type: Article

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