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Volumn , Issue , 1997, Pages 471-474
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An investigation of breakdown in power HEMTs and MESFETs utilising an advanced temperature-dependent physical model
a a a a |
Author keywords
[No Author keywords available]
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Indexed keywords
MESFET DEVICES;
POWER HEMT;
BREAKDOWN PROCESS;
CHANNEL TEMPERATURE;
EXPERIMENTAL VALIDATIONS;
GATE METALLIZATION;
PHYSICAL INTERPRETATION;
PHYSICAL SIMULATION;
SUBSTRATE CONDUCTION;
TEMPERATURE DEPENDENT;
HIGH ELECTRON MOBILITY TRANSISTORS;
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EID: 84897495798
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/ISCS.1998.711717 Document Type: Conference Paper |
Times cited : (4)
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References (6)
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