Electro-thermal device and circuit simulation with thermal nonlinearity due to temperature dependent diffusivity

Electronics Letters

Volumn 36, Issue 23, 2000, Pages 1966-1968

  Batty, W ^a   Snowden, C M ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

NETWORKS (CIRCUITS); THERMAL CONDUCTIVITY; THERMAL DIFFUSION; THERMAL EFFECTS;

ELECTRO-THERMAL DEVICES; KIRCHHOFF TRANSFORMATION;

SEMICONDUCTOR DEVICES;

EID: 0034321291     PISSN: 00135194     EISSN: None     Source Type: Journal    
DOI: 10.1049/el:20001372     Document Type: Article

References (5)

1. JOYCE, W.B.: 'Thermal resistance of heat sinks with temperature-dependent conductivity', Solid-State Electron., 1975, 18, pp. 321-322
2. WROBEL, L.C., and BREBBIA, C.A.: 'The dual reciprocity boundary element formulation for nonlinear diffusion problems', Comput. Methods Appl. Mech. Eng., 1987, 65, pp. 147-164
3. MAYCOCK, P.D.: 'Thermal conductivity of silicon, germanium, III-V compounds and III-V alloys', Solid-State Electron., 1967, 10, pp. 161-168
4. BATTY, W., PANKS, A.J., JOHNSON, R.G., and SNOWDEN, C.M.: 'Electrothermal modelling of monolithic and hybrid microwave and millimeter wave IC's', VLSI Des., 2000, 10, (4), pp. 355-389
5. BATTY, W., CHRISTOFFERSEN, C.E., DAVID, S., PANKS, A.J., JOHNSON, R.G., and SNOWDEN, C.M.: 'Steady-state and transient elecro-thermal simulation of power devices and circuits based on a fully physical thermal model'. THERMINIC 2000, Budapest, September 2000