Electro-thermal and logi-thermal simulation of VLSI designs

IEEE Transactions on Very Large Scale Integration (VLSI) Systems

Volumn 5, Issue 3, 1997, Pages 258-269

  Székely, Vladimir ^a   Poppe, András ^a   Páhi, András ^a   Csendes, Alpár ^a   Hajas, Gábor ^a   Rencz, Márta ^a,b  

^a BUDAPEST UNIVERSITY OF TECHNOLOGY AND ECONOMICS   (Hungary)

^b IEEE

Author keywords

Electro thermal simulation; Logi thermal simulation; Thermal network extraction

Indexed keywords

COMPUTER SIMULATION; INTEGRATED CIRCUIT LAYOUT; INTEGRATED CIRCUIT TESTING; THERMAL EFFECTS;

ELECTROTHERMAL SIMULATION; LOGITHERMAL SIMULATION; SOFTWARE PACKAGE LOGITHERM; SOFTWARE PACKAGE SISSI;

VLSI CIRCUITS;

EID: 0031234333     PISSN: 10638210     EISSN: None     Source Type: Journal    
DOI: 10.1109/92.609868     Document Type: Article

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