메뉴 건너뛰기




Volumn 30, Issue 11, 1999, Pages 1085-1091

Static and dynamic thermal modeling of ICs

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; GREEN'S FUNCTION; HEAT FLUX; MATHEMATICAL MODELS; SPECIFIC HEAT; TEMPERATURE; THERMAL DIFFUSION; THERMODYNAMIC PROPERTIES;

EID: 0033359074     PISSN: 00262692     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2692(99)00069-5     Document Type: Article
Times cited : (32)

References (14)
  • 1
    • 0020717196 scopus 로고
    • Computer simulation of hybrid integrated circuits including combined electrical and thermal effects
    • Zimmer C.R. Computer simulation of hybrid integrated circuits including combined electrical and thermal effects. Electrocomponent Science and Technology. 10:1983;171-176.
    • (1983) Electrocomponent Science and Technology , vol.10 , pp. 171-176
    • Zimmer, C.R.1
  • 2
    • 0343299855 scopus 로고
    • The influence of temperature on integrated circuit failure mechanism
    • Bar-cohen, & Krause. New York: ASME Press
    • Pecht M., Hakim E. The influence of temperature on integrated circuit failure mechanism. Bar-cohen, Krause. Advances in Thermal Modeling of Electronic Components and Systems. 1993;61 ASME Press, New York.
    • (1993) Advances in Thermal Modeling of Electronic Components and Systems , pp. 61
    • Pecht, M.1    Hakim, E.2
  • 3
    • 0015400795 scopus 로고
    • Accurate algorithm for temperature calculation in nonlinear circuit analysis
    • Szekely V., Tarnay K. Accurate algorithm for temperature calculation in nonlinear circuit analysis. Electronics Letters. 8:(19):1972;470-472.
    • (1972) Electronics Letters , vol.8 , Issue.19 , pp. 470-472
    • Szekely, V.1    Tarnay, K.2
  • 5
    • 0031233261 scopus 로고    scopus 로고
    • Realistic and efficient simulation of electro-thermal effects in VLSI circuits
    • Sabry M.N., Bontemps A., Aubert V., Vahrmann R. Realistic and efficient simulation of electro-thermal effects in VLSI circuits. IEEE Trans. VLSI Systems. 5:(3):1997;283-289.
    • (1997) IEEE Trans. VLSI Systems , vol.5 , Issue.3 , pp. 283-289
    • Sabry, M.N.1    Bontemps, A.2    Aubert, V.3    Vahrmann, R.4
  • 7
    • 78651326559 scopus 로고    scopus 로고
    • Simulator coupling for electro-thermal simulation of integrated circuits
    • Budapest, 25-27 September
    • S. Wunsche, Simulator coupling for electro-thermal simulation of integrated circuits, Proceedings of the 2nd Therminic Workshop, Budapest, 25-27 September 1996, pp. 89-93.
    • (1996) Proceedings of the 2nd Therminic Workshop , pp. 89-93
    • Wunsche, S.1
  • 8
    • 0027146655 scopus 로고
    • Thermal component models for electro-thermal network simulation
    • A.R. Hefner, D.L. Blackburn, Thermal component models for electro-thermal network simulation, Ninth IEEE SEMI-THERM Symposium, 1993, pp. 88-97.
    • (1993) Ninth IEEE SEMI-THERM Symposium , pp. 88-97
    • Hefner, A.R.1    Blackburn, D.L.2
  • 10
    • 0024900984 scopus 로고
    • Θjc characterization of chip packages - justification, limitations and future
    • Bar-Cohen A., Elperin T., Eliasi R. Θjc characterization of chip packages - justification, limitations and future. IEEE Transactions CHMT. 12:1989;724-731.
    • (1989) IEEE Transactions CHMT , vol.12 , pp. 724-731
    • Bar-Cohen, A.1    Elperin, T.2    Eliasi, R.3
  • 11
    • 0002073295 scopus 로고
    • DELPHI: The development of libraries of physical models of electronic components for an integrated design environment
    • Atlanta, GA
    • H. Rosten, C. Lasance, DELPHI: the development of libraries of physical models of electronic components for an integrated design environment, Proc. Conf. Int. Elec. Pack. Soc., Atlanta, GA, 1994.
    • (1994) Proc. Conf. Int. Elec. Pack. Soc.
    • Rosten, H.1    Lasance, C.2
  • 13
    • 85031583815 scopus 로고    scopus 로고
    • Propagation analysis for thermal modeling
    • Cannes, 21-23 September
    • D. De Cogan, Propagation analysis for thermal modeling, Proceedings of the Third Therminic Workshop, Cannes, 21-23 September, 1997, pp. 114-120.
    • (1997) Proceedings of the Third Therminic Workshop , pp. 114-120
    • De Cogan, D.1
  • 14
    • 0008777834 scopus 로고    scopus 로고
    • THERMODEL: A tool for compact dynamic thermal model generation
    • Budapest, 25-27 September
    • V. Szekely, THERMODEL: a tool for compact dynamic thermal model generation, Proceedings of the Second Therminic Workshop, Budapest, 25-27 September 1996, pp. 21-26.
    • (1996) Proceedings of the Second Therminic Workshop , pp. 21-26
    • Szekely, V.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.