Simulation, testing and modeling of the thermal behavior and electro-thermal interactions in ICs, MCMs and PWBs

1999 Southwest Symposium on Mixed-Signal Design, SSMSD 1999

Volumn , Issue , 1999, Pages 168-173

  Szekely, V ^a   Renez, M ^a,b   Courtois, B ^c  

^a BUDAPEST UNIVERSITY OF TECHNOLOGY AND ECONOMICS   (Hungary)

^b MicReD Ltd   (Hungary)

^c IMA Lab   (France)

Author keywords

[No Author keywords available]

Indexed keywords

TIMING CIRCUITS;

TESTING AND MODELING; THERMAL BEHAVIORS; THERMAL INTERACTION; TOOLS AND METHODS;

INTEGRATED CIRCUITS;

EID: 0007905669     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SSMSD.1999.768612     Document Type: Conference Paper

References (17)

1. V. Sztkely, M. Rencz, "Fast field solver programs for thermal and electrostatic analysis of microsystem elements", in Proc. of ICCAD'97, Santa Jose, CA, USA, 9-13 NOV 1997, pp. 684-689.
2. A. G. Kokkas, "Thermal analysis of multiple-layer structures, IEEE Trans. on Electron Devices, Vol. ED-21, 1974, pp.674-681.
3. P. Tounsi, J.-M. Dorkel, Ph. Leturcq, P. Vales, Ph. Dupuy : "3D thermal modelling for electronic devices based on the two-port network theory", 2"d THERMINIC Workshop, 25-27 Sept. 1996, Budapest, Proceedings pp.27-34
4. G. N. Ellison: "Thermal analysis of circuit boards and microelectronic components using an analytical solution to the heat conduction equation", 12 SEMITHERM Symposium, March. 5-7 1996, Austin, USA, Proceedings pp. 144-150.
5. V. Szkkely, A. Poppe, "Novel tools for thermal and electrical analysis of circuits", Electrosoft, Vol. I, 1990 pp. 234-252.
6. A. Csendes, V. Sztkely, M. Rencz: "An efficient thermal simulation tool for ICs, microsystem elements and MCMs: the pS-THERMANAL, Microelectronics Journal, Vol. 29, 1998, pp. 241-255.
7. V. Sztkely, Tran Van Bien: "Fine structure of heat flow path in semiconductor devices: a measurement and identification method, Solid-state Electronics, Vol. 31, 1988, pp. 1363-1368.
8. V. Sztkely: "On the representation of infinite-length distributed RC one-ports", IEEE Trans. on Circuits and Systems, Vol. 38, 1991, pp. 711-719.
9. V. Sztkely: "THERMODEL: a tool for compact dynamic thermal model generation", Micro-electronics Journal, Vol. 29, 1998, pp. 257-267
10. V.SzCkely, A. Poppe, M.Rencz, M.Rosenta1, T.Tesztri: "Therman: a thermal simulation tool for IC chips. ." submitted to MIXDES'99, Krakow, Poland
11. L. O. Chua, Pen-Min Lin, "Computer-Aided analysis of electronic circuits", Prentice-Hall, Englewood Cliffs, 1975.
12. http://www.netlib.org/sparse, "Sparse 1.3"
13. A.Csendes, V.Sztkely, M.Rencz: "Thermal Mapping with Liquid Crystal Method", Microelectronic Engineering, V.3 1. pp 28 1-290 (1996)
14. A. Phi, V. Sztkely, M. Rosenthal, M. Rencz: "3D extension of the SUNRED field solver", THERMINIC'98 Workshop, 27-30 Sept. 1998, Cannes, France, Proc. pp. 185-190
15. D.G.Gardner et.al.: "Method for the analysis of multicomponent exponential decay curves", The Journal of Chemical Physics, V.3 I, No.4, Oct. 1959, pp.978-986
16. V. Szkkely: "Identification of RC Networks by Deconvolution: Chances and Limits", IEEE Transaction on Circuits and Systems-I. Theory and Applications, V01.45, No.3, March 1998, pp 244-258.
17. M.Rencg V.Szkkely, A.Phi, A.Poppe: "An alternative method for electro-thermal circuit simulation", this issue.