Three-dimensional thermal modeling based on the two-port network theory for hybrid or monolithic integrated power circuits

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 19, Issue 4, 1996, Pages 501-507

  Dorkel, Jean Marie ^a   Tounsi, Patrick ^a   Leturcq, Philippe ^a  

^a LAAS CNRS   (France)

Author keywords

3 D thermal modeling; Plane multilayered systems; Thermal design of integrated or hybrid power circuits; Transient thermal analysis; Two port network theory

Indexed keywords

ALGORITHMS; BIPOLAR TRANSISTORS; CIRCUIT THEORY; FAST FOURIER TRANSFORMS; HEAT CONDUCTION; HYBRID INTEGRATED CIRCUITS; MONOLITHIC INTEGRATED CIRCUITS; SEMICONDUCTOR DEVICE MODELS; THERMAL EFFECTS; THERMOANALYSIS;

INSULATED GATE BIPOLAR POWER TRANSISTORS (IGBT); THREE DIMENSIONAL CONDUCTIVE HEAT TRANSFER; TWO PORT NETWORK THEORY;

POWER ELECTRONICS;

EID: 0030418778     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.554931     Document Type: Article

References (5)

1. H. S. Carslaw and J. C. Jaeger, Conduction of Heat in Solids, 2nd ed. London, U.K.: Oxford Press, 1959.
2. M. N. Özisik, Heat Conduction. New York: Wiley, 1980.
3. P. Antognetti, G. R. Bisio, F. Curatelli, and S. Palara, "Three-Dimensional transient thermal simulation: Application to delayed short circuit protection in power IC's," IEEE J. Solid-State Circuits, vol SC-15, no. 3, June 1980.
4. P. Leturcq, F. E. Ratolojanahary, and P. Morillon, "Méthodologie de caractérization thermique de supports et substrats pour l'électronique de puissance," in Proc. "Colloque bilan des actions de recherche du Ministère de la Recherche et de la Technologie, " Actes Génie Electrique 91, Oct. 91, pp. 83-96.
5. P. Leturcq, J.-M. Dorkel, F. E. Ratolojanahary, and P. Tounsi, "A two-port network formalism for 3D heat conduction analysis in multilayered media," Int. J. Heat and Mass Transfer, vol. 36, no. 9, pp. 2317-2326, 1993.