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Volumn , Issue , 1999, Pages 117-122

An alternative method for electro-thermal circuit simulation

Author keywords

[No Author keywords available]

Indexed keywords

ITERATIVE METHODS; TIMING CIRCUITS;

EID: 0007948544     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SSMSD.1999.768603     Document Type: Conference Paper
Times cited : (13)

References (14)
  • 1
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    • Petegem, W.V.1
  • 2
    • 0037992070 scopus 로고
    • Atlas: An integrated thermal layout and simulation system of ic-s
    • Paris, France March
    • W.H. Kao, W.K. Chu. "ATLAS: An Integrated Thermal Layout and Simulation System of IC-s" In Proc. of EDCeTC'94, Paris, France, March 1994.
    • (1994) Proc. of EDCeTC'94
    • Kao, W.H.1    Chu, W.K.2
  • 3
    • 0029755985 scopus 로고    scopus 로고
    • Ets-A: A new electrothermal simulator for CMOS VLSI circuits
    • Paris, France March
    • Y-K. Cheng et al. "ETS-A: A New Electrothermal Simulator for CMOS VLSI Circuits" In Proc. of EDCeTC'96, pp. 566-570, Paris, France, March 1996.
    • (1996) Proc. of EDCeTC'96 , pp. 566-570
    • Cheng, Y.-K.1
  • 4
    • 85037547681 scopus 로고    scopus 로고
    • Efficient transient electrothermal simulation of CMOS VLSI circuits under electrical overstress
    • San Jose, CA
    • T. Li, C.H. Tsai, S.M. Kang: "Efficient Transient Electrothermal Simulation of CMOS VLSI Circuits under Electrical Overstress" In Proc. of ICCAD'98,San Jose, CA
    • Proc. of ICCAD'98
    • Li, T.1    Tsai, C.H.2    Kang, S.M.3
  • 5
    • 0031234840 scopus 로고    scopus 로고
    • Fully coupled dynamic electro-thermal simulation
    • G. Diegele et al. "Fully coupled Dynamic Electro-Thermal Simulation" IEEE Transactions on VLSI Systenzs, 5(3):250-257, 1997
    • (1997) IEEE Transactions on VLSI Systenzs , vol.5 , Issue.3 , pp. 250-257
    • Diegele, G.1
  • 6
    • 0031233261 scopus 로고    scopus 로고
    • Realistic and efficient simulation of electro-thermal effects in VLSI circuits
    • M.N. Sabry et al. "Realistic and Efficient Simulation of Electro-Thermal Effects in VLSI Circuits" IEEE Tr. on VLSISystems, 5(3):283-289, 1997.
    • (1997) IEEE Tr. on VLSISystems , vol.5 , Issue.3 , pp. 283-289
    • Sabry, M.N.1
  • 7
    • 0039976509 scopus 로고    scopus 로고
    • Self-consistent electro-thermal simulation: Fundamentals and practice
    • V. Szekely et al. "Self-consistent electro-thermal simulation: fundamentals and practice" Microelectronics Journal, 28:247-262, 1997.
    • (1997) Microelectronics Journal , vol.28 , pp. 247-262
    • Szekely, V.1
  • 8
    • 0027850837 scopus 로고
    • Electrothermal simulation of integrated circuits
    • S.S. Lee. D.J. Allstot: Electrothermal simulation of integrated circuits, IEEE Journal of Solid-State Circuits, SSC-28( 12): 1283-1293, 1993
    • (1993) IEEE Journal of Solid-State Circuits , vol.SSC-28 , Issue.12 , pp. 1283-1293
    • Lee, D.J.1    Allstot, S.S.2
  • 9
    • 0031234333 scopus 로고    scopus 로고
    • Electro-thermal and logi-thermal simulation of VLSI designs
    • V. Szekely et.al.: Electro-thermal and logi-thermal simulation of VLSI designs IEEE Transactions on VLSI Systems 5 3): 258-269, 1997
    • (1997) IEEE Transactions on VLSI Systems , vol.5 , Issue.3 , pp. 258-269
    • Szekely, V.1
  • 10
    • 0007905669 scopus 로고    scopus 로고
    • Simulation. Testing and modeling of the thermal behavior and electro-thermal interactions in ics, mcms and pwbs
    • Tuscon, AZ, USA
    • V. Szekely, M. Rencz, B. Courtois: "Simulation. Testing and Modeling of the Thermal Behavior and Electro-Thermal Interactions in ICs, MCMs and PWBs" In Proc. of SSMSD'99, Tuscon, AZ, USA, 1999.
    • (1999) Proc. of SSMSD'99
    • Szekely, V.1    Rencz, M.2    Courtois, B.3
  • 11
    • 0030718130 scopus 로고    scopus 로고
    • Sisssi-A tool for dynamic electrothermal simulation of analog VLSI cells
    • Paris, France March
    • V. Szekely et al. "SISSSI-A tool for dynamic electrothermal simulation of analog VLSI cells" Proc. of ED&TC'97, p. 617, Paris, France, March 1997.
    • (1997) Proc. of ED&TC'97 , pp. 617
    • Szekely, V.1
  • 14
    • 0001963238 scopus 로고    scopus 로고
    • An implementation of electrothermal component models in a general purpose circuit simulation program
    • Cannes, France September
    • T. Veijola et al. "An implementation of electrothermal component models in a general purpose circuit simulation program" In Proc. of the 3rd THERMINIC Workshop, pp. 96-100, Cannes, France, September 1997.
    • (1997) Proc. of the 3rd THERMINIC Workshop , pp. 96-100
    • Veijola, T.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.