A rational formulation of thermal circuit models for electrothermal simulation-part II: Model reduction techniques

IEEE Transactions on Circuits and Systems I: Fundamental Theory and Applications

Volumn 43, Issue 9, 1996, Pages 733-744

  Hsu, Jia Tzer ^a   Vu Quoc, Loc ^a  

^a UNIVERSITY OF FLORIDA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRONICS PACKAGING; HEAT SINKS; POWER CONVERTERS; POWER ELECTRONICS; SEMICONDUCTING SILICON; VECTORS;

COMPONENT MODE SYNTHESIS METHOD; ELECTROTHERMAL SIMULATION; MODAL SUPERPOSITION METHOD; MODEL ERROR ESTIMATION; MODEL REDUCTION TECHNIQUES; RITZ VECTOR METHOD; THERMAL CIRCUIT MODELS;

SEMICONDUCTOR DEVICE MODELS;

EID: 0030244881     PISSN: 10577122     EISSN: None     Source Type: Journal    
DOI: 10.1109/81.536743     Document Type: Article

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