Integrated environment for the simulation of electrical, thermal and electromagnetic interactions in high-performance integrated circuits

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn , Issue , 1999, Pages 217-220

  Gutierrez, Hector M ^a   Christoffersen, Carlos E ^a   Steer, Michael B ^a  

^a FLORIDA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER AIDED NETWORK ANALYSIS; COMPUTER SIMULATION; ELECTRIC NETWORK SYNTHESIS; FINITE ELEMENT METHOD; HEAT LOSSES; INTEGRATED CIRCUIT LAYOUT; INTERFACES (COMPUTER); LUMPED PARAMETER NETWORKS; SEMICONDUCTOR DEVICE MODELS;

APPLICATION PROGRAM INTERFACE (API); ELECTRO-THERMAL INTERACTIONS; THERMAL MODELING;

ELECTRONICS PACKAGING;

EID: 0033320507     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (9)