-
1
-
-
0012621254
-
Stress singularity near the crack-tip in silicon carbide: Investigation by atomic force microscopy
-
Kinoshita T (1998) Stress singularity near the crack-tip in silicon carbide: investigation by atomic force microscopy. Acta Mater 46:3963-3974
-
(1998)
Acta Mater
, vol.46
, pp. 3963-3974
-
-
Kinoshita, T.1
-
2
-
-
0002963356
-
Fracture and fatigue behavior of single crystal silicon microelements and nanoscopic AFM damage evaluation
-
Komai K, Minoshima K, Inoue S (1998) Fracture and fatigue behavior of single crystal silicon microelements and nanoscopic AFM damage evaluation. Microsys TechnoI5:30-37
-
(1998)
Microsys Technoi
, vol.5
, pp. 30-37
-
-
Komai, K.1
Minoshima, K.2
Inoue, S.3
-
3
-
-
0033682150
-
Effect of the cure temperature on the morphology of a cyanate ester resin modified with a thermoplastic: Characterization by atomic force microscopy
-
Marieta C, del Rio M, Harismendy I, Mondragon I (2000) Effect of the cure temperature on the morphology of a cyanate ester resin modified with a thermoplastic: characterization by atomic force microscopy. Eur Polym J 36: 1445-1454
-
(2000)
Eur Polym J
, vol.36
, pp. 1445-1454
-
-
Marieta, C.1
Del Rio, M.2
Harismendy, I.3
Mondragon, I.4
-
4
-
-
0035097390
-
Atomic force microscopic study of the microcracking of magnetic thin films under tension
-
Bobji MS, Bushan B (2001) Atomic force microscopic study of the microcracking of magnetic thin films under tension. Scripta Mater 44:37-42
-
(2001)
Scripta Mater
, vol.44
, pp. 37-42
-
-
Bobji, M.S.1
Bushan, B.2
-
5
-
-
0036029615
-
Improving atomic force microscopy with the adaptation of ultrasonic force microscopy
-
Druffner CJ, Sathish Sh (2002) Improving atomic force microscopy with the adaptation of ultrasonic force microscopy. Proc SPIE 4703: 105-113
-
(2002)
Proc SPIE
, vol.4703
, pp. 105-113
-
-
Druffner, C.J.1
Sh, S.2
-
6
-
-
0036681733
-
High resolution AFM scanning Moire method and its application to the micro-deformation in the BGA electronic package
-
Xie H, Asundi A, Boay CG, Yungguang L, Yu J, Zhaowei Z, Ngoi BKA (2002) High resolution AFM scanning Moire method and its application to the micro-deformation in the BGA electronic package. Microelectronics Reliability 42:1219-1227
-
(2002)
Microelectronics Reliability
, vol.42
, pp. 1219-1227
-
-
Xie, H.1
Asundi, A.2
Boay, C.G.3
Yungguang, L.4
Yu, J.5
Zhaowei, Z.6
Ngoi, B.K.A.7
-
7
-
-
0034878629
-
Micro-Moire methods-optical and scanning techniques
-
Asundi A, Huimin X, Chongxiang L, Boay CG, Eng OK (2001) Micro-Moire methods-optical and scanning techniques. Proc SPlE 4416:54-57
-
(2001)
Proc Sple
, vol.4416
, pp. 54-57
-
-
Asundi, A.1
Huimin, X.2
Chongxiang, L.3
Boay, C.G.4
Eng, O.K.5
-
9
-
-
0036504397
-
A new microtensile tester for the study of MEMS materials with the aid of atomic force microscopy
-
Chasiotis I, Knauss W (2002) A new microtensile tester for the study of MEMS materials with the aid of atomic force microscopy. Experimental Mech 42:51-57
-
(2002)
Experimental Mech
, vol.42
, pp. 51-57
-
-
Chasiotis, I.1
Knauss, W.2
-
10
-
-
0035773676
-
Characterization of electronic packaging materials and components by image correlation methods, advanced photonic sensors and applications II, Nov 27-30, 2001, Singapore
-
Vogel D, Auersperg J, Michel B (2001) Characterization of electronic packaging materials and components by image correlation methods, advanced photonic sensors and applications II, Nov 27-30, 2001, Singapore. Proc SPIE 4596:237-247
-
(2001)
Proc SPIE
, vol.4596
, pp. 237-247
-
-
Vogel, D.1
Auersperg, J.2
Michel, B.3
-
11
-
-
54049083120
-
Microcrack evaluation for electronics components by AFM nan-oDAC deformation measurement
-
Oct 28-30, 2001, Maui, Hawaii, pp
-
II. Vogel D, Michel B (2001) Microcrack evaluation for electronics components by AFM nan-oDAC deformation measurement. Proc IEEE-NANO 2001, Oct 28-30, 2001, Maui, Hawaii, pp 309-312
-
(2001)
Proc IEEE-NANO 2001
, pp. 309-312
-
-
Vogel, D.1
Michel, B.2
-
12
-
-
84948949451
-
Displacement and strain field measurements for nanotechnology applications
-
August 26-28, Washington DC
-
Vogel D, Keller J, Golihardt A, Michel B (2002) Displacement and strain field measurements for nanotechnology applications. Proc 2002 2nd IEEE conference on nanotechnology, IEEE NANO 2002, August 26-28, Washington DC
-
(2002)
Proc 2002 2Nd IEEE Conference on Nanotechnology, IEEE NANO 2002
-
-
Vogel, D.1
Keller, J.2
Golihardt, A.3
Michel, B.4
-
16
-
-
0031336898
-
-
Orlando, pp
-
Vogel D, Auersperg J, Schubert A, Michel B, Reichl H (1997) Deformation analysis on flip chip solder interconnects by microDAC. Proc reliability of solders and solder joints symposium at 126th TMS annual meeting&exhibition, Orlando, pp 429-438
-
(1997)
Deformation Analysis on Flip Chip Solder Interconnects by Microdac. Proc Reliability of Solders and Solder Joints Symposium at 126Th TMS Annual meeting&exhibition
, pp. 429-438
-
-
Vogel, D.1
Auersperg, J.2
Schubert, A.3
Michel, B.4
Reichl, H.5
-
17
-
-
0035425174
-
MicroDAC strain measurement for electronics packaging structures
-
Vogel D, Grosser V, Schubert A, Michel B (2001) MicroDAC strain measurement for electronics packaging structures. Opt Lasers Eng 36: 195-211
-
(2001)
Opt Lasers Eng
, vol.36
, pp. 195-211
-
-
Vogel, D.1
Grosser, V.2
Schubert, A.3
Michel, B.4
-
18
-
-
0020797243
-
Determination of displacements using an improved digital correlation method
-
Sutton MA, Wolters WJ, Peters WH, Ranson WF, McNeill SR (1983) Determination of displacements using an improved digital correlation method. Image Vision Comput 1: 133-139
-
(1983)
Image Vision Comput
, vol.1
, pp. 133-139
-
-
Sutton, M.A.1
Wolters, W.J.2
Peters, W.H.3
Ranson, W.F.4
McNeill, S.R.5
-
22
-
-
0030288653
-
MicroDAC-A novel approach to measure in-situ deformation fields of microscopic scale
-
Vogel D, Schubert A, Faust W, Dudek R, Michel B (1996) MicroDAC-A novel approach to measure in-situ deformation fields of microscopic scale. Proc ESREF '96, Enschede, pp 1939-1942
-
(1996)
Proc ESREF '96, Enschede
, pp. 1939-1942
-
-
Vogel, D.1
Schubert, A.2
Faust, W.3
Dudek, R.4
Michel, B.5
-
23
-
-
0010963444
-
-
Kyoto, pp
-
Vogel D, Simon J, Schubert A, Michel B (1998) High resolution deformation measurement on CSP and flip chip. Technical digest of the fourth VLSI packaging workshop of Japan, Kyoto, pp 84-86
-
(1998)
High Resolution Deformation Measurement on CSP and Flip Chip. Technical Digest of the Fourth VLSI Packaging Workshop of Japan
, pp. 84-86
-
-
Vogel, D.1
Simon, J.2
Schubert, A.3
Michel, B.4
-
24
-
-
0033694037
-
Measurement of thermally induced strains on flip chip and chip scale packages. Proc ITherm 2000
-
pp
-
Vogel D, Kaulfersch E, Simon J, Kuhnert R, Schubert A, Michel B (2000) Measurement of thermally induced strains on flip chip and chip scale packages. Proc ITherm 2000, Las Vegas, USA, May 23-26, pp 232-239
-
(2000)
Las Vegas, USA, May
, vol.23-26
, pp. 232-239
-
-
Vogel, D.1
Kaulfersch, E.2
Simon, J.3
Kuhnert, R.4
Schubert, A.5
Michel, B.6
-
25
-
-
0034927233
-
Experimental and Numerical Characterization on in-plane deformation in two-phase materials
-
Soppa E, Doumalin P, Binkele P, Wiesendanger T, Bornert B, Schmauder S (2001) Experimental and Numerical Characterization on in-plane deformation in two-phase materials. Comput Mater Sci 21:261-275
-
(2001)
Comput Mater Sci
, vol.21
, pp. 261-275
-
-
Soppa, E.1
Doumalin, P.2
Binkele, P.3
Wiesendanger, T.4
Bornert, B.5
Schmauder, S.6
-
26
-
-
0035955476
-
AFM characterization of the evolution of surface deformation during fatigue in polycrystalline copper
-
Cretegny L, Saxena A (2001) AFM characterization of the evolution of surface deformation during fatigue in polycrystalline copper. Acta Mater 49:3755-3765
-
(2001)
Acta Mater
, vol.49
, pp. 3755-3765
-
-
Cretegny, L.1
Saxena, A.2
-
27
-
-
0034272306
-
Effect of bump height on the strain variation during the thermal cycling test ofACA flip-chip joints
-
Pinardi K, Lai Z, Vogel D, Kang YL, Liu J, Liu Sh, Haug R, Willander M (2000) Effect of bump height on the strain variation during the thermal cycling test ofACA flip-chip joints. IEEE Trans Comp Pack Techn 23:447-451
-
(2000)
IEEE Trans Comp Pack Techn
, vol.23
, pp. 447-451
-
-
Pinardi, K.1
Lai, Z.2
Vogel, D.3
Kang, Y.L.4
Liu, J.5
Liu, S.6
Haug, R.7
Willander, M.8
-
28
-
-
3843141865
-
Lead-free flip-chip solder interconnects-materials mechanics and reliability issues
-
pp
-
Schubert A, Dudek R, Walter H, Jung E, Gollhardt A, Michel B (2001) Lead-free flip-chip solder interconnects-materials mechanics and reliability issues. Proc APACK: Int Conf on Advances in Packaging, Singapore, Dec 5-7, 2001, pp 274-287
-
(2001)
Proc APACK: Int Conf on Advances in Packaging, Singapore, Dec 5-7
, pp. 274-287
-
-
Schubert, A.1
Dudek, R.2
Walter, H.3
Jung, E.4
Gollhardt, A.5
Michel, B.6
-
29
-
-
85073672834
-
-
Sinaia, Romania
-
Puigcorbe J, Vogel D, Michel B, Vila A, Sabate N, Gracia I, Cane C, Morante JR (2002) AFM analysis of high temperature degradation in MEMS elements. MME'02, The 13th Micromechanics Europe Workshop, October 6-8, 2002, Sinaia, Romania
-
(2002)
AFM Analysis of High Temperature Degradation in MEMS Elements. MME'02, the 13Th Micromechanics Europe Workshop, October 6-8
, pp. 2002
-
-
Puigcorbe, J.1
Vogel, D.2
Michel, B.3
Vila, A.4
Sabate, N.5
Gracia, I.6
Cane, C.7
Morante, J.R.8
-
30
-
-
0346308577
-
A study of the effects of packaging induced stress on the reliability of the Sandia MEMS Microengine
-
Hawaii, USA
-
O'Neal CB, Malshe AP, Schmidt WF, Gordon MH, Reynolds RR, Brown WD, Eaton WP, Miller WM (2001) A study of the effects of packaging induced stress on the reliability of the Sandia MEMS Microengine. Proc IPACK2001: The Pacific RimlASME international electronic packaging technical conference and exhibition, July 8-13, 2001, Hawaii, USA
-
(2001)
Proc IPACK2001: The Pacific Rimlasme International Electronic Packaging Technical Conference and Exhibition, July 8-13
, pp. 2001
-
-
O'neal, C.B.1
Malshe, A.P.2
Schmidt, W.F.3
Gordon, M.H.4
Reynolds, R.R.5
Brown, W.D.6
Eaton, W.P.7
Miller, W.M.8
-
31
-
-
0005567637
-
Experimental validation of finite element modeling
-
Zhang GQ (ed), Kluwer, Boston, pp
-
Vogel D, Chen Jian, de Wolf! (2000) Experimental validation of finite element modeling. In: Zhang GQ (ed) Benefiting from thermal and mechanical simulations in micro-electron-ics. Kluwer, Boston, pp 113-133
-
(2000)
Benefiting from Thermal and Mechanical Simulations in Micro-Electron-Ics
, pp. 113-133
-
-
Vogel, D.1
Jian, C.2
Wolf!3
-
32
-
-
0242466828
-
Gains and challenges of parameterized finite element modeling of microelectronics packages
-
Michel B, Fraunhofer IZM, Berlin, pp
-
Auersperg J, Doring R, Michel B (2002) Gains and challenges of parameterized finite element modeling of microelectronics packages. In: Michel B (ed) Micromaterials and nano-materials, no 1, Fraunhofer IZM, Berlin, pp 26-29
-
(2002)
Micromaterials and Nano-Materials
, vol.1
, pp. 26-29
-
-
Auersperg, J.1
Doring, R.2
Michel, B.3
-
33
-
-
0036544005
-
Thermo-me-chanical analysis of micro-drop coated gas sensors
-
Puigcorbe J, Vila A, Cerda J, Cirera A, Gracia I, Cane C, Morante JR (2002) Thermo-me-chanical analysis of micro-drop coated gas sensors. Sens Actuators A 97:379-385
-
(2002)
Sens Actuators A
, vol.97
, pp. 379-385
-
-
Puigcorbe, J.1
Vila, A.2
Cerda, J.3
Cirera, A.4
Gracia, I.5
Cane, C.6
Morante, J.R.7
-
38
-
-
0017417249
-
Continuum theory of ductile rupture by void nucleation and growth: Part I-yield criteria and flow rules for porous ductile media
-
Gurson AL Continuum theory of ductile rupture by void nucleation and growth: Part I-yield criteria and flow rules for porous ductile media, Trans ASME. J Eng Mat Tech 99:2-13
-
Trans ASME. J Eng Mat Tech
, vol.99
, pp. 2-13
-
-
Gurson, A.L.1
|