Displacement and strain field measurements for nanotechnology applications

Proceedings of the IEEE Conference on Nanotechnology

Volumn 2002-January, Issue , 2002, Pages 37-40

  Vogel, D ^a   Keller, J ^a   Gollhardt, A ^a   Michel, B ^a  

^a FRAUNHOFER IZM   (Germany)

Author keywords

Displacement measurement; Force measurement; Kinematics; Nanotechnology; Optical imaging; Optical microscopy; Scanning electron microscopy; Size measurement; Stability; Strain measurement

Indexed keywords

CONVERGENCE OF NUMERICAL METHODS; FORCE MEASUREMENT; KINEMATICS; MOTION ANALYSIS; NANOTECHNOLOGY; OPTICAL MICROSCOPY; SCANNING ELECTRON MICROSCOPY; STRAIN MEASUREMENT;

CROSS-CORRELATION ALGORITHM; MEASUREMENT METHODS; NANOTECHNOLOGY APPLICATIONS; OPTICAL IMAGING; PARTICLE MOTION TRACKING; SIZE MEASUREMENTS; STRAIN FIELD MEASUREMENT; STRAIN FIELDS;

DISPLACEMENT MEASUREMENT;

EID: 84948949451     PISSN: 19449399     EISSN: 19449380     Source Type: Conference Proceeding    
DOI: 10.1109/NANO.2002.1032118     Document Type: Conference Paper

References (3)

1. A. Asundi, Huimin Xie, Chai Gin Boay, "High Resolution Micro-Moiré Methods - Principles and Applications", Symp. on Advanced Photonic Sensors and Applications II, Singapore, 27-30 Nov. 2001, Proc. of SPIE, Vol. 4596, pp. 261-271.
2. D. Vogel, J. Auersperg, B. Michel, "Characterization of Electronic Packaging Materials and Components by Image Correlation Methods", Symp. on Advanced Photonic Sensors and Applications II, Singapore, 27-30 Nov. 2001, Proc. of SPIE, Vol. 4596, pp. 237-247.
3. D. Vogel, E. Kaulfersch, J. Simon, R. Kühnert, A. Schubert, B. Michel, "Measurement of Thermally Induced Strains on Flip Chip and Chip Scale Packages", Proc. of ITherm 2000, Las Vegas, USA, 2000, May 23-26, pp. 232-239.