Microdac - A novel approach to measure in situ deformation fields of microscopic scale

Microelectronics Reliability

Volumn 36, Issue 11-12 SPEC. ISS., 1996, Pages 1939-1942

  Vogel, D ^a   Schubert, A ^a   Faust, W ^a   Dudek, R ^a   Michel, B ^a  

^a FRAUNHOFER IZM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ALGORITHMS; CORRELATION METHODS; DEFORMATION; ELECTRIC FIELD EFFECTS; IMAGE ANALYSIS; LASER APPLICATIONS; SCANNING; SCANNING ELECTRON MICROSCOPY; STRAIN MEASUREMENT; STRESS CONCENTRATION; THERMAL LOAD;

DEFORMATION FIELD MEASUREMENT; MICRO DEFORMATION ANALYSIS BY CORRELATION METHODS (MICRODAC); OBJECT STRUCTURE TRACKING;

ELECTRONICS PACKAGING;

EID: 0030288653     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/0026-2714(96)00233-8     Document Type: Article

References (3)

1. R.R. Tummala, E.J. Rymaszewski, Microel Pack. Handb., Van Nostr. Reinh., N.Y., (1989).
2. B.Michel et al, Experimental and numerical investigations of thermo-mechanically stressed micro-components, Microsystem Techn., 1, 1, 14-22 (1994).
3. D. Vogel et al, Mat. mech. studies on chip cards, MicroMat '95, pp 221-226, Berlin (1995).