Characterization of electronic packaging materials and components by image correlation methods

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4596, Issue , 2001, Pages 237-247

  Vogel, Dietmar ^a   Auersperg, Juergen ^a   Michel, Bernd ^a  

^a FRAUNHOFER IZM   (Germany)

Author keywords

AFM; Electronic packaging; Image correlation technique; Mechanical strain; MicroDAC; NanoDAC; SEM

Indexed keywords

ALGORITHMS; ATOMIC FORCE MICROSCOPY; DEFORMATION; MICROCRACKS; OPTICAL CORRELATION; POISSON RATIO; THERMAL EXPANSION; THERMAL LOAD;

IMAGE CORRELATION METHODS;

CHIP SCALE PACKAGES;

EID: 0035773676     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.447348     Document Type: Conference Paper

References (12)

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