A study of the effects of packaging induced stress on the reliability of the sandia MEMS microengine

Advances in Electronic Packaging

Volumn 1, Issue , 2001, Pages 129-135

  O'Neal, Chad B ^a   Malshe, Ajay P ^a   Schmidt, William F ^a   Gordon, Matthew H ^a   Reynolds, Robert R ^a   Brown, William D ^b   Eaton, William P ^c,d   Miller, William M ^c  

^a 3202 Bell Engineering Center   (United States)

^b UNIVERSITY OF ARKANSAS   (United States)

^c SANDIA NATIONAL LABORATORIES   (United States)

^d Solus Micro Technologies   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

MICROENGINES; PACKAGING INDUCED STRESSES;

ACTUATORS; DEFORMATION; ELASTIC MODULI; FINITE ELEMENT METHOD; MICROELECTROMECHANICAL DEVICES; RELIABILITY; SENSORS; SOLDERING ALLOYS; STRAIN GAGES; STRESSES; X RAY DIFFRACTION;

ELECTRONICS PACKAGING;

EID: 0346308577     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

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2. A.P. Malshe, C.B. O'Neal, S.B. Singh, W.D. Brown, W.P.Eaton, W.M. Miller, "Challenges in the Packaging of MEMS", International Journal of Microcircuits and Electronic Packaging, vol. 22, no. 3, pp. 233-241, 1999.
3. D.J. Monk and M.K. Shah, "Packaging and Testing Considerations of Bulk Micromachined, Piezoresistive Pressure Sensors", Motorola Sensor Products Division.
4. P. McWhorter, "MEMS Reliability Short Course", Sandia National Laboratories, Section 2, p.12, November 1999.
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6. N.F. Smith, W.P. Eaton, D.M. Tanner, J.J. Allen, "Development of characterization tools for reliability testing", MEMS Reliability for Critical and Space Applications, Proc. of SPIE, Vol 3880, pp. 156-164.
7. J. Glezen, "Gold Electroplating of CVD Diamond", Masters Thesis, Department of Electrical Engineering, University of Arkansas, 1995.
8. C.B. O'Neal, "Establishment of a Test Station and Measurements for Determining the Effects of Packaging Induced Stress on MEMS Devices", Masters Thesis, Department of Mechanical Engineering, University of Arkansas, 2000.
9. B. Chandran, W.F. Schmidt, M.H. Gordon, R. Djkaria, "Determination and Utilization of AuSn Solder Creep Properties to Bond GaAs Dice to Diamond Substrates", ASME, EEP Application of CAE/CAD to Electronic Systems, Proceedings of the 1996 ASME International Mechanical Engineering Congress and Exposition, Nov. 17-22, Atlanta, GA, vol. 18, pp. 61-66.
10. D.M. Tanner, "Reliability of Surface Micromachined MicroElectroMechanical Actuators", Invited Keynote at the 22nd International Conference in Microelectronics, Nis, Yugoslavia, May 2000, pp. 97-104.