Measurement of thermally induced strains on flip chip and chip scale packages

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2, Issue , 2000, Pages 232-239

  Vogel, D ^a   Kaulfersch, E ^a   Simon, J ^a   Kuehnert, R ^a   Schubert, A ^a   Michel, B ^a  

^a FRAUNHOFER IZM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; FATIGUE OF MATERIALS; FLIP CHIP DEVICES; GLASS FIBERS; LAMINATES; PRINTED CIRCUIT BOARDS; RELIABILITY; SCANNING ELECTRON MICROSCOPY; SHEAR DEFORMATION; STRAIN MEASUREMENT; THERMAL STRESS;

CHIP SCALE PACKAGES; LASER SCANNING MICROSCOPY; SOLDER BALL; THERMOMECHANICAL RELIABILITY;

THERMAL VARIABLES MEASUREMENT;

EID: 0033694037     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (11)