Microstructures and properties of Sn58Bi, Sn35Bi0.3Ag, Sn35Bi1.0Ag solder and solder joints

Journal of Materials Science: Materials in Electronics

Volumn 26, Issue 10, 2015, Pages 7629-7634

  Zhang, Liang ^a   Sun, Lei ^a   Guo, Yong huan ^a  

^a JIANGSU NORMAL UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

BISMUTH COMPOUNDS; FATIGUE OF MATERIALS; INTERMETALLICS; MICROSTRUCTURE; SILVER; SOLDERING ALLOYS; WETTING;

FATIGUE BEHAVIOR; INTERFACE REACTIONS; LINE TEMPERATURES; LIQUID PHASE; MELTING CHARACTERISTICS; MICROSTRUCTURES AND PROPERTIES; SOLDER JOINTS; STRENGTHENING EFFECT;

TIN;

EID: 84941937438     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-015-3400-x     Document Type: Article

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