Effect of Sb content on properties of Sn - Bi solders

Transactions of Nonferrous Metals Society of China (English Edition)

Volumn 24, Issue 1, 2014, Pages 184-191

  Zhang, Cheng ^a   Liu, Si Dong ^a   Qian, Guo Tong ^b   Zhou, Jian ^a   Xue, Feng ^a  

^a SOUTHEAST UNIVERSITY   (China)

^b Shaoxing Tianlong Sn Materials Co Ltd   (China)

Author keywords

lead free solder Sn Bi Sb alloy microstructure melting behavior wettability

Indexed keywords

ALLOY MICROSTRUCTURE; CU SUBSTRATE; EUTECTIC STRUCTURES; HIGHER MELTING POINTS; MELTING BEHAVIOR; MELTING RANGE; NON EQUILIBRIUM; REACTION LAYERS;

DIFFERENTIAL SCANNING CALORIMETRY; EUTECTICS; MECHANICAL PROPERTIES; SOLDERING ALLOYS; TIN ALLOYS; WETTING;

TIN;

EID: 84893179220     PISSN: 10036326     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1003-6326(14)63046-6     Document Type: Article

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