Effects of Zn, Zn-Al and Zn-P additions on the tensile properties of Sn-Bi solder

Acta Metallurgica Sinica (English Letters)

Volumn 27, Issue 6, 2014, Pages 1159-1164

  Wang, Xiaojing ^a   Wang, Yanlai ^b   Wang, Fengjiang ^a   Liu, Ning ^a   Wang, Jianxin ^a  

^a JIANGSU UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

^b INNER MONGOLIA UNIVERSITY   (China)

Author keywords

Microstructure; Sn Bi; Tensile test

Indexed keywords

ADDITIVES; ALUMINUM; BINARY ALLOYS; DUCTILE FRACTURE; METAL TESTING; MICROSTRUCTURE; TENSILE STRENGTH; TENSILE TESTING;

ANTIOXIDANT CAPACITY; FRACTOGRAPHIC ANALYSIS; OXIDATION BEHAVIORS; OXIDATION FILM; SOLDER ALLOYS; TRACE AMOUNTS; ULTIMATE TENSILE STRENGTH; XPS ANALYSIS;

LEAD-FREE SOLDERS;

EID: 84912089093     PISSN: 10067191     EISSN: 21941289     Source Type: Journal    
DOI: 10.1007/s40195-014-0165-9     Document Type: Article

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