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Journal of Materials Science: Materials in Electronics
Volumn 21, Issue 10, 2010, Pages 1090-1098
Thermomigration and electromigration in Sn58Bi ball grid array solder joints
Author keywords

[No Author keywords available]
Indexed keywords

ANODE SIDE; BALL GRID ARRAY SOLDER JOINTS; COMBINED EFFECT; DIRECT CURRENT; ELECTRON CHARGE; LOW TEMPERATURES; SOLDER BUMP; THERMOMIGRATION;
EID: 77957895683     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-009-9992-2     Document Type: Article
Times cited : (26)
References (18)
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.