Solderability and intermetallic compounds formation of Sn-9Zn-xAg lead-free solders wetted on Cu substrate

Rare Metals

Volumn 28, Issue 6, 2009, Pages 656-660

  Chen, Wenxue ^a   Xue, Songbai ^a   Wang, Hui ^a   Wang, Jianxin ^a   Han, Zongjie ^a  

^a NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS   (China)

Author keywords

Intermetallic compounds; Lead free solder; Soldering materials; Wettability

Indexed keywords

CU SUBSTRATE; INTERFACIAL INTERMETALLICS; INTERMETALLIC COMPOUNDS; LEAD FREE SOLDERS; LEAD-FREE SOLDER ALLOY; LIQUID SOLDERS; NEEDLE-LIKE; PERITECTIC REACTION; RICH PHASE; SN-9ZN SOLDER; SN-ZN SOLDER; SOLDERABILITY; SOLDERING MATERIALS; WETTING BEHAVIOR; WETTING PROPERTY;

ALLOYS; COPPER ALLOYS; LEAD; LEAD COMPOUNDS; MICROSTRUCTURE; PHASE INTERFACES; PRECIPITATION (CHEMICAL); SEMICONDUCTING INTERMETALLICS; SILVER; SILVER ALLOYS; SOLDERED JOINTS; SOLDERING; SOLDERING ALLOYS; SULFUR COMPOUNDS; TIN ALLOYS; WETTING; ZINC;

TIN;

EID: 72949091214     PISSN: 10010521     EISSN: 18677185     Source Type: Journal    
DOI: 10.1007/s12598-009-0125-0     Document Type: Article

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