Effect of dispersed SiC nano-particles in eutectic Sn58Bi solder micro-bumps of wafer level package by electroplating

10th Electronics Packaging Technology Conference, EPTC 2008

Volumn , Issue , 2008, Pages 279-284

  Shin, Yue Seon ^a,b   Lee, Se Hyung ^a   Lee, Chang Woo ^a   Jung, Seung Boo ^b   Kim, Jeong Han ^a  

^a Korea Institute of Industrial Technology   (South Korea)

^b Sungkyunkwan University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

BRAZING; CHIP SCALE PACKAGES; COARSENING; ELECTRONIC EQUIPMENT MANUFACTURE; EUTECTICS; GRAIN GROWTH; NANOPARTICLES; SEMICONDUCTING INTERMETALLICS; SEMICONDUCTING SILICON COMPOUNDS; SHEAR STRENGTH; SILICON CARBIDE; WELDING;

GRAIN COARSENING; GROWTH OF INTERMETALLICS; HOMOGENIZER; MICRO-BUMPS; PATTERNED WAFERS; PLATING SOLUTIONS; SHEAR TESTS; SIC PARTICLES; SOLDER BUMPS; WAFER LEVEL PACKAGES;

SOLDERING ALLOYS;

EID: 63049118613     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2008.4763448     Document Type: Conference Paper

References (11)

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