Effect of purging gas on wetting behavior of Sn-3.5Ag lead-free solder on nickel-coated aluminum substrate

Journal of Materials Engineering and Performance

Volumn 22, Issue 3, 2013, Pages 723-728

  Prabhu, K N ^a   Varun, M ^a   Satyanarayan, ^a  

^a NATIONAL INSTITUTE OF TECHNOLOGY KARNATAKA   (India)

Author keywords

IMCs; lead free solder; soldering atmosphere; wetting

Indexed keywords

ALUMINUM; ALUMINUM COATINGS; ARGON; BINARY ALLOYS; CONTACT ANGLE; MORPHOLOGY; NEEDLES; NICKEL COATINGS; NITROGEN; PHASE INTERFACES; SILVER ALLOYS; SOLDERING; SUBSTRATES; THERMAL CONDUCTIVITY OF GASES; TIN; TIN ALLOYS; WETTING;

ALUMINUM SUBSTRATE; ARGON ATMOSPHERES; IMCS; INTERFACIAL MICROSTRUCTURE; NITROGEN ATMOSPHERES; SN-3.5AG LEAD-FREE SOLDERS; WETTING BEHAVIOR; WETTING CHARACTERISTICS;

LEAD-FREE SOLDERS;

EID: 84878531287     PISSN: 10599495     EISSN: 15441024     Source Type: Journal    
DOI: 10.1007/s11665-012-0339-4     Document Type: Article

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