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Volumn 44, Issue 1, 2015, Pages 532-541
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Effects of Cu, Zn on the Wettability and Shear Mechanical Properties of Sn-Bi-Based Lead-Free Solders
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Author keywords
composite; shear property; Sn Bi based alloy; wettability
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Indexed keywords
BINARY ALLOYS;
BISMUTH ALLOYS;
COMPOSITE MATERIALS;
CONTACT ANGLE;
COPPER;
FRACTURE MECHANICS;
INTERMETALLICS;
MECHANICAL PROPERTIES;
SHEAR FLOW;
SOLDERED JOINTS;
TERNARY ALLOYS;
TIN ALLOYS;
WETTING;
ZINC;
BI-BASED;
CHEMICAL ACTIVITIES;
INTERMETALLIC COMPOUND LAYER;
LEAD-FREE SOLDER JOINT;
SHEAR PROPERTIES;
SOLDER ALLOYS;
SOLDER JOINTS;
WETTING FORCE;
LEAD-FREE SOLDERS;
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EID: 84925533329
PISSN: 03615235
EISSN: 1543186X
Source Type: Journal
DOI: 10.1007/s11664-014-3460-3 Document Type: Article |
Times cited : (23)
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References (21)
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