Sn-3.0Ag-0.5Cu nanocomposite solder reinforced with Bi2Te3 nanoparticles

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 5, Issue 8, 2015, Pages 1186-1196

  Chen, Si ^a,b   Luo, Xin ^a,b   Jiang, Di ^b   Ye, Lilei ^c   Edwards, Michael ^b   Liu, Johan ^a,b  

^a SHANGHAI UNIVERSITY   (China)

^b CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

^c SHT SMART HIGH TECH AB   (Sweden)

Author keywords

BiTe nanoparticles; Nanocomposite solders; Sn 3.0Ag 0.5Cu.

Indexed keywords

BISMUTH COMPOUNDS; ELECTRONICS PACKAGING; ENERGY DISPERSIVE SPECTROSCOPY; FLIP CHIP DEVICES; HIGH RESOLUTION TRANSMISSION ELECTRON MICROSCOPY; LEAD-FREE SOLDERS; MASS SPECTROMETRY; MICROSTRUCTURE; NANOCOMPOSITES; NANOPARTICLES; NARROW BAND GAP SEMICONDUCTORS; PACKAGING MATERIALS; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTING BISMUTH COMPOUNDS; SEMICONDUCTING SILVER COMPOUNDS; SEMICONDUCTING TELLURIUM COMPOUNDS; SEMICONDUCTING TIN COMPOUNDS; SOLDERED JOINTS; SOLDERING; TERNARY ALLOYS; THERMAL EXPANSION; THERMAL FATIGUE;

ELECTRONIC PACKAGING; ENERGY DISPERSIVE X RAY SPECTROSCOPY; HIGH MECHANICAL STRENGTH; INTERCONNECT MATERIALS; NANOCOMPOSITE SOLDER; REFINED MICROSTRUCTURE; SEMICONDUCTOR NANOPARTICLES; SN-3.0AG-0.5CU;

SULFUR COMPOUNDS;

EID: 84939793211     PISSN: 21563950     EISSN: 21563985     Source Type: Journal    
DOI: 10.1109/TCPMT.2015.2446497     Document Type: Article

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