Analysis of solder joint failure criteria and measurement techniques in the qualification of electronic products

IEEE Transactions on Components and Packaging Technologies

Volumn 31, Issue 2 SPEC. ISS., 2008, Pages 469-477

  Qi, Haiyu ^a   Vichare, Nikhil M ^a   Azarian, Michael H ^b   Pecht, Michael ^b  

^a DELL INC   (United States)

^b UNIVERSITY OF MARYLAND   (United States)

Author keywords

Accelerated testing; Ball grid array (BGA); Interconnects; Reliability; Solder

Indexed keywords

ACCELERATED TESTING; BALL GRID ARRAY (BGA); BALL GRID ARRAY PACKAGES; ELECTRICAL RESISTANCES; ELECTRONIC PRODUCTS; EXPERIMENTAL STUDIES; FAILURE CRITERION; INTERCONNECTS; KEY ATTRIBUTES; LONG-TERM DRIFTS; MEASUREMENT TECHNIQUES; RELIABILITY TESTING; RESISTANCE CHANGES; SOLDER; SOLDER JOINTS; THERMO-MECHANICAL FATIGUES;

BALL GRID ARRAYS; BRAZING; ELECTRONICS INDUSTRY; FAILURE ANALYSIS; QUALITY ASSURANCE;

WELDING;

EID: 58449096609     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2008.921647     Document Type: Conference Paper

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