Sn-Ag-Cu solders and solder joints: Alloy development, microstructure, and properties

JOM

Volumn 54, Issue 6, 2002, Pages 26-29

  Anderson, I E ^a   Cook, B A ^a   Harringa, J L ^a   Terpstra, R L ^a  

^a IOWA STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COBALT; COOLING; COPPER ALLOYS; INTERFACES (MATERIALS); MECHANICAL TESTING; MICROSTRUCTURE; SHEAR STRENGTH; SOLDERED JOINTS; SUBSTITUTION REACTIONS; SURFACE MOUNT TECHNOLOGY; TIN ALLOYS;

DENDRITES; JOINT MICROSTRUCTURE; SHEAR STRENGTH TESTING;

SOLDERING ALLOYS;

EID: 0036612353     PISSN: 10474838     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF02701845     Document Type: Article

References (19)

1. The creep of lead-free solders at elevated temperatures
2. What else is in the refrigerator?
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4. Research update: Lead-free solder alternatives
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6. Alloying effects in near-eutectic Sn-Ag-Cu solder alloys for improved microstructural stability
7. Implementing Pb-free soldering
8. Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys
9. Progress report: High temperature solder alloys for underhood applications
10. Progress in the design of new lead-free solder alloys
11. Pb-free Sn-Ag-Cu ternary eutectic solder
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13. Pb-free solder
14. Reflow soldering and isothermal solid-state aging of Sn-Ag eutectic solder on Au/Ni surface finish
15. Application of asymmetrical four point bend shear test to solder joints
16. Microstructural modifications and properties of Sn-Ag-Cu solder joints induced by alloying
17. Development of eutectic and near-eutectic Tin-Silver-Cu solder alloys for lead-free joining applications