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Volumn 23, Issue 3, 2011, Pages 140-149

Interfacial reaction and dissolution behavior of Cu substrate in molten Sn-3.8Ag-0.7Cu in the presence of Mo nanoparticles

Author keywords

Alloys; Copper; Dissolution behavior; Intermetallic compound (IMC); Metals; Mo nanoparticles; Solder; Substrates

Indexed keywords

COMPOSITE SOLDERS; COPPER SUBSTRATES; CU SUBSTRATE; DESIGN/METHODOLOGY/APPROACH; DISSOLUTION BEHAVIOR; DISSOLUTION RATES; ELECTRONIC PACKAGING; ENERGY DISPERSIVE X-RAY SPECTROSCOPY; FIELD EMISSION SEM; IMC LAYER; IMC THICKNESS; IMMERSION TIME; INTERMETALLIC COMPOUND (IMC); LIQUID SOLDERS; SAC-SOLDERS; SCANNING ELECTRON MICROSCOPES; SOLDER; SOLDER PASTE; SOLID-LIQUID INTERFACES;

EID: 79960708815     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540911111146890     Document Type: Article
Times cited : (23)

References (37)
  • 1
    • 0346305056 scopus 로고    scopus 로고
    • Effect of 0.5 wt% Cu addition in the Sn-3.5%Ag solder on the dissolution rate of Cu metallization
    • Alam, M.O., Chan, Y.C. and Tu, K.N. (2003), “Effect of 0.5 wt% Cu addition in the Sn-3.5%Ag solder on the dissolution rate of Cu metallization”, J. Appl. Phys., Vol. 94, pp. 7904-9.
    • (2003) J. Appl. Phys. , vol.94 , pp. 7904-7909
    • Alam, M.O.1    Chan, Y.C.2    Tu, K.N.3
  • 2
    • 39149119686 scopus 로고    scopus 로고
    • A study of nanoparticles in Sn-Ag based lead free solders
    • Amagai, M. (2008), “A study of nanoparticles in Sn-Ag based lead free solders”, Microelectron. Reliab., Vol. 48, pp. 1-16.
    • (2008) Microelectron. Reliab. , vol.48 , pp. 1-16
    • Amagai, M.1
  • 3
    • 0022776173 scopus 로고
    • Composite solders
    • Anon (1986), “Composite solders”, IBM Technical Disclosure Bull., Vol. 29, pp. 1573-4.
    • (1986) IBM Technical Disclosure Bull. , vol.29 , pp. 1573-1574
  • 4
    • 51649155415 scopus 로고
    • The Ag-Mo (silver-molybdenum) system
    • Baren, M.R. (1990), “The Ag-Mo (silver-molybdenum) system”, Journal of Phase Equilibria, Vol. 11 No. 6, pp. 548-9.
    • (1990) Journal of Phase Equilibria , vol.11 , Issue.6 , pp. 548-549
    • Baren, M.R.1
  • 6
    • 33646027161 scopus 로고
    • The Mo-Sn (molybdenum-tin) system
    • Brewer, L. and Lamoreaux, R.H. (1980), “The Mo-Sn (molybdenum-tin) system”, Journal of Phase Equilibria, Vol. 1 No. 2, pp. 96-7.
    • (1980) Journal of Phase Equilibria , vol.1 , Issue.2 , pp. 96-97
    • Brewer, L.1    Lamoreaux, R.H.2
  • 8
    • 67349261300 scopus 로고    scopus 로고
    • Effect of nanoparticle size on the onset temperature of surface melting
    • Chernyshev, A.P. (2009), “Effect of nanoparticle size on the onset temperature of surface melting”, Mater. Lett., Vol. 63, pp. 1525-7.
    • (2009) Mater. Lett. , vol.63 , pp. 1525-1527
    • Chernyshev, A.P.1
  • 10
    • 0942266962 scopus 로고    scopus 로고
    • Thickening kinetics of interfacial Cu6Sn5 and Cu3Sn layers during reaction of liquid tin with solid copper
    • Gagliano, R.A. and Fine, M.E. (2003), “Thickening kinetics of interfacial Cu6Sn5 and Cu3Sn layers during reaction of liquid tin with solid copper”, J. Electron. Mater., Vol. 32 No. 12, pp. 1441-7.
    • (2003) J. Electron. Mater. , vol.32 , Issue.12 , pp. 1441-1447
    • Gagliano, R.A.1    Fine, M.E.2
  • 11
    • 70049090201 scopus 로고    scopus 로고
    • Nanoparticles of SnAgCu lead-free solder alloy with an equivalent melting temperature of SnPb solder alloy
    • Gao, Y., Zou, C., Yang, B., Zhai, Q., Liu, J., Zhuravlev, E. and Schick, C. (2009), “Nanoparticles of SnAgCu lead-free solder alloy with an equivalent melting temperature of SnPb solder alloy”, J. Alloys Compd., Vol. 484, pp. 777-81.
    • (2009) J. Alloys Compd. , vol.484 , pp. 777-781
    • Gao, Y.1    Zou, C.2    Yang, B.3    Zhai, Q.4    Liu, J.5    Zhuravlev, E.6    Schick, C.7
  • 12
    • 0029193520 scopus 로고
    • Metallurgy of low temperature Pb-free solders for electronic assembly
    • Glazer, J. (1995), “Metallurgy of low temperature Pb-free solders for electronic assembly”, Int. Mater. Rev., Vol. 40 No. 2, pp. 65-93.
    • (1995) Int. Mater. Rev. , vol.40 , Issue.2 , pp. 65-93
    • Glazer, J.1
  • 13
    • 0000072496 scopus 로고    scopus 로고
    • Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening
    • Kim, H.K. and Tu, T.N. (1996), “Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening”, Physical Review B, Vol. 53 No. 23, pp. 16027-34.
    • (1996) Physical Review B , vol.53 , Issue.23 , pp. 16027-16034
    • Kim, H.K.1    Tu, T.N.2
  • 16
    • 37349121122 scopus 로고    scopus 로고
    • Single-wall carbon nanotube (SWCNT) functionalized Sn-Ag-Cu lead-free composite solders
    • Kumar, K.M., Kripesh, V. and Tay, A.A.O. (2008), “Single-wall carbon nanotube (SWCNT) functionalized Sn-Ag-Cu lead-free composite solders”, J. Alloys Compd., Vol. 450, pp. 229-37.
    • (2008) J. Alloys Compd. , vol.450 , pp. 229-237
    • Kumar, K.M.1    Kripesh, V.2    Tay, A.A.O.3
  • 17
    • 77949490697 scopus 로고    scopus 로고
    • Impurity and alloying effects on interfacial reaction layers in Pb-free soldering
    • Laurila, T., Vuorinen, V. and Paulasto-Kröckel, M. (2010), “Impurity and alloying effects on interfacial reaction layers in Pb-free soldering”, Mat. Sci. Eng. R, Vol. 68, pp. 1-38.
    • (2010) Mat. Sci. Eng. R , vol.68 , pp. 1-38
    • Laurila, T.1    Vuorinen, V.2    Paulasto-Kröckel, M.3
  • 18
    • 0038347098 scopus 로고    scopus 로고
    • Influence of titanium dioxide nanopowder addition on microstructural development and hardness of tin-lead solder
    • Lin, D.C., Wang, G.X., Srivatsana, T.S., Al-Hajri, M. and Petraroli, M. (2003), “Influence of titanium dioxide nanopowder addition on microstructural development and hardness of tin-lead solder”, Mater. Lett., Vol. 57, pp. 3193-8.
    • (2003) Mater. Lett. , vol.57 , pp. 3193-3198
    • Lin, D.C.1    Wang, G.X.2    Srivatsana, T.S.3    Al-Hajri, M.4    Petraroli, M.5
  • 19
    • 60849118139 scopus 로고    scopus 로고
    • Interfacial reaction between Sn-1Ag-0.5Cu(-Co) solder and Cu substrate with Au/Ni surface finish during reflow reaction
    • Lin, K.S., Huang, H.Y. and Chou, C.P. (2009), “Interfacial reaction between Sn-1Ag-0.5Cu(-Co) solder and Cu substrate with Au/Ni surface finish during reflow reaction”, J. Alloys Compd., Vol. 471, pp. 291-5.
    • (2009) J. Alloys Compd. , vol.471 , pp. 291-295
    • Lin, K.S.1    Huang, H.Y.2    Chou, C.P.3
  • 20
    • 42449127939 scopus 로고    scopus 로고
    • Effect of SiC nanoparticle additions on microstructure and microhardness of Sn-Ag-Cu solder alloy
    • Liu, P., Yao, P. and Liu, J. (2008), “Effect of SiC nanoparticle additions on microstructure and microhardness of Sn-Ag-Cu solder alloy”, J. Electron. Mater., Vol. 37 No. 6, pp. 874-9.
    • (2008) J. Electron. Mater. , vol.37 , Issue.6 , pp. 874-879
    • Liu, P.1    Yao, P.2    Liu, J.3
  • 21
    • 7244231051 scopus 로고    scopus 로고
    • Materials and processes for implementing high temperature liquid interconnects
    • Mannan, S.H. and Clode, M.P. (2004), “Materials and processes for implementing high temperature liquid interconnects”, IEEE Trans. Adv. Pack., Vol. 27 No. 3, pp. 508-14.
    • (2004) IEEE Trans. Adv. Pack. , vol.27 , Issue.3 , pp. 508-514
    • Mannan, S.H.1    Clode, M.P.2
  • 22
    • 72549086281 scopus 로고    scopus 로고
    • Estimation method for liquidus temperature of lead-free solder using differential scanning calorimetry profiles
    • Nishikawa, H., Hamada, Y. and Takemoto, T. (2009), “Estimation method for liquidus temperature of lead-free solder using differential scanning calorimetry profiles”, J. Electron. Mater., Vol. 38 No. 12, pp. 2610-6.
    • (2009) J. Electron. Mater. , vol.38 , Issue.12 , pp. 2610-2616
    • Nishikawa, H.1    Hamada, Y.2    Takemoto, T.3
  • 24
    • 26444485487 scopus 로고    scopus 로고
    • Size effect on melting temperature of nanosolids
    • Qi, W.H. (2005), “Size effect on melting temperature of nanosolids”, Physica B, Vol. 368, pp. 46-50.
    • (2005) Physica B , vol.368 , pp. 46-50
    • Qi, W.H.1
  • 25
    • 0347355001 scopus 로고    scopus 로고
    • Dissolution kinetics of BGA Sn-Pb and Sn-Ag solders with Cu substrates during reflow
    • Sharif, A. and Chan, Y.C. (2004), “Dissolution kinetics of BGA Sn-Pb and Sn-Ag solders with Cu substrates during reflow”, Mater. Sci. Eng. B, Vol. 106, pp. 126-31.
    • (2004) Mater. Sci. Eng. B , vol.106 , pp. 126-131
    • Sharif, A.1    Chan, Y.C.2
  • 26
    • 60849092529 scopus 로고    scopus 로고
    • Research advances in nano-composite solders
    • Shen, J. and Chan, Y.C. (2009), “Research advances in nano-composite solders”, Microelectron. Reliab., Vol. 49 No. 3, pp. 223-34.
    • (2009) Microelectron. Reliab. , vol.49 , Issue.3 , pp. 223-234
    • Shen, J.1    Chan, Y.C.2
  • 27
    • 33748690770 scopus 로고    scopus 로고
    • Strengthening effects of ZrO2 nanoparticles on the microstructure and microhardness of Sn-3.5Ag lead-free solder
    • Shen, J., Liu, Y.C., Han, Y.J., Tian, Y.M. and Gao, H.X. (2006), “Strengthening effects of ZrO2 nanoparticles on the microstructure and microhardness of Sn-3.5Ag lead-free solder”, J. Electron. Mater., Vol. 35, pp. 1672-9.
    • (2006) J. Electron. Mater. , vol.35 , pp. 1672-1679
    • Shen, J.1    Liu, Y.C.2    Han, Y.J.3    Tian, Y.M.4    Gao, H.X.5
  • 28
    • 0032156161 scopus 로고    scopus 로고
    • Melting and freezing behaviour of embedded nanoparticles in ball-milled Al±10 wt% M (M=In, Sn, Bi, Cd, Pb) mixtures
    • Sheng, H.W., Lu, K. and Ma, E. (1998), “Melting and freezing behaviour of embedded nanoparticles in ball-milled Al±10 wt% M (M=In, Sn, Bi, Cd, Pb) mixtures”, Acta Mater., Vol. 46 No. 14, pp. 5195-205.
    • (1998) Acta Mater. , vol.46 , Issue.14 , pp. 5195-5205
    • Sheng, H.W.1    Lu, K.2    Ma, E.3
  • 29
    • 0031250797 scopus 로고    scopus 로고
    • Interfacial reactions in molten Sn/Cu and molten In/Cu couples
    • Su, L.H., Yen, Y.W., Lin, C.C. and Chen, S.W. (1997), “Interfacial reactions in molten Sn/Cu and molten In/Cu couples”, Metallurg. Mater. Trans. B, Vol. 28 No. 5, pp. 927-34.
    • (1997) Metallurg. Mater. Trans. B , vol.28 , Issue.5 , pp. 927-934
    • Su, L.H.1    Yen, Y.W.2    Lin, C.C.3    Chen, S.W.4
  • 30
  • 31
    • 79960741635 scopus 로고    scopus 로고
    • Addition of cobalt nanoparticles into Sn-3.8Ag-0.7Cu lead-free solder by paste mixing
    • (accepted)
    • Tay, S.L., Haseeb, A.S.M.A. and Johan, M.R. (n.d.), “Addition of cobalt nanoparticles into Sn-3.8Ag-0.7Cu lead-free solder by paste mixing”, Solder. Surf. Mt. Tech., (accepted).
    • Solder. Surf. Mt. Tech.
    • Tay, S.L.1    Haseeb, A.S.M.A.2    Johan, M.R.3
  • 32
    • 67349083563 scopus 로고    scopus 로고
    • Effects of minor Fe, Co, and Ni additions on the reaction between SnAgCu solder and Cu
    • Wang, Y.W., Lin, Y.W., Tu, C.T. and Kao, C.R. (2009), “Effects of minor Fe, Co, and Ni additions on the reaction between SnAgCu solder and Cu”, J. Alloys Compd., Vol. 478, pp. 121-7.
    • (2009) J. Alloys Compd. , vol.478 , pp. 121-127
    • Wang, Y.W.1    Lin, Y.W.2    Tu, C.T.3    Kao, C.R.4
  • 33
    • 33745012896 scopus 로고    scopus 로고
    • Dissolution behavior of Cu and Ag substrates in molten solders
    • Yeh, P.Y., Song, J.M. and Lin, K.L. (2006), “Dissolution behavior of Cu and Ag substrates in molten solders”, J. Electron. Mater., Vol. 35 No. 5, pp. 978-87.
    • (2006) J. Electron. Mater. , vol.35 , Issue.5 , pp. 978-987
    • Yeh, P.Y.1    Song, J.M.2    Lin, K.L.3
  • 34
    • 37249046517 scopus 로고    scopus 로고
    • Investigation and dissolution behavior of metallic substrates and intermetallic compound in molten lead-free solders
    • Yen, Y.W., Chou, W.T., Tseng, Y., Lee, C. and Hsu, C.L. (2008), “Investigation and dissolution behavior of metallic substrates and intermetallic compound in molten lead-free solders”, J. Electron. Mater., Vol. 37 No. 1, pp. 73-83.
    • (2008) J. Electron. Mater. , vol.37 , Issue.1 , pp. 73-83
    • Yen, Y.W.1    Chou, W.T.2    Tseng, Y.3    Lee, C.4    Hsu, C.L.5
  • 35
    • 79958223410 scopus 로고    scopus 로고
    • Current crowding induced electromigration failure in flip chip technology
    • Yeth, E.C.C., Choi, W.J. and Tu, K.N. (2002), “Current crowding induced electromigration failure in flip chip technology”, Appl. Phys. Lett., Vol. 80, pp. 580-2.
    • (2002) Appl. Phys. Lett. , vol.80 , pp. 580-582
    • Yeth, E.C.C.1    Choi, W.J.2    Tu, K.N.3
  • 36
    • 13444252734 scopus 로고    scopus 로고
    • The formation of nano-Ag3Sn particles on the intermetallic compounds during wetting reaction
    • Yu, D.Q., Wang, L., Wu, C.M.L. and Law, C.M.T. (2005), “The formation of nano-Ag3Sn particles on the intermetallic compounds during wetting reaction”, J. Alloys Compd., Vol. 389, pp. 153-8.
    • (2005) J. Alloys Compd. , vol.389 , pp. 153-158
    • Yu, D.Q.1    Wang, L.2    Wu, C.M.L.3    Law, C.M.T.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.