-
1
-
-
0346305056
-
Effect of 0.5 wt% Cu addition in the Sn-3.5%Ag solder on the dissolution rate of Cu metallization
-
Alam, M.O., Chan, Y.C. and Tu, K.N. (2003), “Effect of 0.5 wt% Cu addition in the Sn-3.5%Ag solder on the dissolution rate of Cu metallization”, J. Appl. Phys., Vol. 94, pp. 7904-9.
-
(2003)
J. Appl. Phys.
, vol.94
, pp. 7904-7909
-
-
Alam, M.O.1
Chan, Y.C.2
Tu, K.N.3
-
2
-
-
39149119686
-
A study of nanoparticles in Sn-Ag based lead free solders
-
Amagai, M. (2008), “A study of nanoparticles in Sn-Ag based lead free solders”, Microelectron. Reliab., Vol. 48, pp. 1-16.
-
(2008)
Microelectron. Reliab.
, vol.48
, pp. 1-16
-
-
Amagai, M.1
-
3
-
-
0022776173
-
Composite solders
-
Anon (1986), “Composite solders”, IBM Technical Disclosure Bull., Vol. 29, pp. 1573-4.
-
(1986)
IBM Technical Disclosure Bull.
, vol.29
, pp. 1573-1574
-
-
-
4
-
-
51649155415
-
The Ag-Mo (silver-molybdenum) system
-
Baren, M.R. (1990), “The Ag-Mo (silver-molybdenum) system”, Journal of Phase Equilibria, Vol. 11 No. 6, pp. 548-9.
-
(1990)
Journal of Phase Equilibria
, vol.11
, Issue.6
, pp. 548-549
-
-
Baren, M.R.1
-
5
-
-
70349932966
-
Dissolution kinetics of nickel in lead-free Sn-Bi-In-Zn-Sb soldering alloys
-
Barmak, K., Berry, D.C., Khoruzha, V.G., Meleshevich, K.A. and Dybkov, V.I. (2007), “Dissolution kinetics of nickel in lead-free Sn-Bi-In-Zn-Sb soldering alloys”, Mater. Res. Soc. Symp. Proc., p. 993.
-
(2007)
Mater. Res. Soc. Symp. Proc.
, pp. 993
-
-
Barmak, K.1
Berry, D.C.2
Khoruzha, V.G.3
Meleshevich, K.A.4
Dybkov, V.I.5
-
6
-
-
33646027161
-
The Mo-Sn (molybdenum-tin) system
-
Brewer, L. and Lamoreaux, R.H. (1980), “The Mo-Sn (molybdenum-tin) system”, Journal of Phase Equilibria, Vol. 1 No. 2, pp. 96-7.
-
(1980)
Journal of Phase Equilibria
, vol.1
, Issue.2
, pp. 96-97
-
-
Brewer, L.1
Lamoreaux, R.H.2
-
7
-
-
77950953472
-
Effect of strain rate and temperature on tensile flow behavior of SnAgCu nanocomposite solders
-
Chandra Rao, B.S.S., Mohan Kumar, K., Zeng, K.Y., Tay, A.A.O. and Kripesh, V. (2009), “Effect of strain rate and temperature on tensile flow behavior of SnAgCu nanocomposite solders”, 11th Electronic Packaging Technology Conference (EPTC 2009), Singapore, December 9-11, pp. 272-7.
-
(2009)
11th Electronic Packaging Technology Conference (EPTC 2009), Singapore, December 9-11
, pp. 272-277
-
-
Chandra Rao, B.S.S.1
Mohan Kumar, K.2
Zeng, K.Y.3
Tay, A.A.O.4
Kripesh, V.5
-
8
-
-
67349261300
-
Effect of nanoparticle size on the onset temperature of surface melting
-
Chernyshev, A.P. (2009), “Effect of nanoparticle size on the onset temperature of surface melting”, Mater. Lett., Vol. 63, pp. 1525-7.
-
(2009)
Mater. Lett.
, vol.63
, pp. 1525-1527
-
-
Chernyshev, A.P.1
-
10
-
-
0942266962
-
Thickening kinetics of interfacial Cu6Sn5 and Cu3Sn layers during reaction of liquid tin with solid copper
-
Gagliano, R.A. and Fine, M.E. (2003), “Thickening kinetics of interfacial Cu6Sn5 and Cu3Sn layers during reaction of liquid tin with solid copper”, J. Electron. Mater., Vol. 32 No. 12, pp. 1441-7.
-
(2003)
J. Electron. Mater.
, vol.32
, Issue.12
, pp. 1441-1447
-
-
Gagliano, R.A.1
Fine, M.E.2
-
11
-
-
70049090201
-
Nanoparticles of SnAgCu lead-free solder alloy with an equivalent melting temperature of SnPb solder alloy
-
Gao, Y., Zou, C., Yang, B., Zhai, Q., Liu, J., Zhuravlev, E. and Schick, C. (2009), “Nanoparticles of SnAgCu lead-free solder alloy with an equivalent melting temperature of SnPb solder alloy”, J. Alloys Compd., Vol. 484, pp. 777-81.
-
(2009)
J. Alloys Compd.
, vol.484
, pp. 777-781
-
-
Gao, Y.1
Zou, C.2
Yang, B.3
Zhai, Q.4
Liu, J.5
Zhuravlev, E.6
Schick, C.7
-
12
-
-
0029193520
-
Metallurgy of low temperature Pb-free solders for electronic assembly
-
Glazer, J. (1995), “Metallurgy of low temperature Pb-free solders for electronic assembly”, Int. Mater. Rev., Vol. 40 No. 2, pp. 65-93.
-
(1995)
Int. Mater. Rev.
, vol.40
, Issue.2
, pp. 65-93
-
-
Glazer, J.1
-
13
-
-
0000072496
-
Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening
-
Kim, H.K. and Tu, T.N. (1996), “Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening”, Physical Review B, Vol. 53 No. 23, pp. 16027-34.
-
(1996)
Physical Review B
, vol.53
, Issue.23
, pp. 16027-16034
-
-
Kim, H.K.1
Tu, T.N.2
-
14
-
-
28444449853
-
Nano-particle reinforced solders for fine pitch applications
-
Kumar, K.M. and Tay, A.A.O. (2004), “Nano-particle reinforced solders for fine pitch applications”, Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004), Singapore, pp. 455-61.
-
(2004)
Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004), Singapore
, pp. 455-461
-
-
Kumar, K.M.1
Tay, A.A.O.2
-
15
-
-
33845590698
-
Sn-Ag-Cu lead-free composite solders for ultra-fine-pitch wafer-level packaging
-
IEEE Publications, Washington, DC
-
Kumar, K.M., Kripesh, V. and Tay, A.A.O. (2006), “Sn-Ag-Cu lead-free composite solders for ultra-fine-pitch wafer-level packaging”, Proceedings of Electronic Components and Technology Conference (ECTC 2006), San Diego, CA, IEEE Publications, Washington, DC, pp. 237-43.
-
(2006)
Proceedings of Electronic Components and Technology Conference (ECTC 2006), San Diego, CA
, pp. 237-243
-
-
Kumar, K.M.1
Kripesh, V.2
Tay, A.A.O.3
-
16
-
-
37349121122
-
Single-wall carbon nanotube (SWCNT) functionalized Sn-Ag-Cu lead-free composite solders
-
Kumar, K.M., Kripesh, V. and Tay, A.A.O. (2008), “Single-wall carbon nanotube (SWCNT) functionalized Sn-Ag-Cu lead-free composite solders”, J. Alloys Compd., Vol. 450, pp. 229-37.
-
(2008)
J. Alloys Compd.
, vol.450
, pp. 229-237
-
-
Kumar, K.M.1
Kripesh, V.2
Tay, A.A.O.3
-
17
-
-
77949490697
-
Impurity and alloying effects on interfacial reaction layers in Pb-free soldering
-
Laurila, T., Vuorinen, V. and Paulasto-Kröckel, M. (2010), “Impurity and alloying effects on interfacial reaction layers in Pb-free soldering”, Mat. Sci. Eng. R, Vol. 68, pp. 1-38.
-
(2010)
Mat. Sci. Eng. R
, vol.68
, pp. 1-38
-
-
Laurila, T.1
Vuorinen, V.2
Paulasto-Kröckel, M.3
-
18
-
-
0038347098
-
Influence of titanium dioxide nanopowder addition on microstructural development and hardness of tin-lead solder
-
Lin, D.C., Wang, G.X., Srivatsana, T.S., Al-Hajri, M. and Petraroli, M. (2003), “Influence of titanium dioxide nanopowder addition on microstructural development and hardness of tin-lead solder”, Mater. Lett., Vol. 57, pp. 3193-8.
-
(2003)
Mater. Lett.
, vol.57
, pp. 3193-3198
-
-
Lin, D.C.1
Wang, G.X.2
Srivatsana, T.S.3
Al-Hajri, M.4
Petraroli, M.5
-
19
-
-
60849118139
-
Interfacial reaction between Sn-1Ag-0.5Cu(-Co) solder and Cu substrate with Au/Ni surface finish during reflow reaction
-
Lin, K.S., Huang, H.Y. and Chou, C.P. (2009), “Interfacial reaction between Sn-1Ag-0.5Cu(-Co) solder and Cu substrate with Au/Ni surface finish during reflow reaction”, J. Alloys Compd., Vol. 471, pp. 291-5.
-
(2009)
J. Alloys Compd.
, vol.471
, pp. 291-295
-
-
Lin, K.S.1
Huang, H.Y.2
Chou, C.P.3
-
20
-
-
42449127939
-
Effect of SiC nanoparticle additions on microstructure and microhardness of Sn-Ag-Cu solder alloy
-
Liu, P., Yao, P. and Liu, J. (2008), “Effect of SiC nanoparticle additions on microstructure and microhardness of Sn-Ag-Cu solder alloy”, J. Electron. Mater., Vol. 37 No. 6, pp. 874-9.
-
(2008)
J. Electron. Mater.
, vol.37
, Issue.6
, pp. 874-879
-
-
Liu, P.1
Yao, P.2
Liu, J.3
-
21
-
-
7244231051
-
Materials and processes for implementing high temperature liquid interconnects
-
Mannan, S.H. and Clode, M.P. (2004), “Materials and processes for implementing high temperature liquid interconnects”, IEEE Trans. Adv. Pack., Vol. 27 No. 3, pp. 508-14.
-
(2004)
IEEE Trans. Adv. Pack.
, vol.27
, Issue.3
, pp. 508-514
-
-
Mannan, S.H.1
Clode, M.P.2
-
22
-
-
72549086281
-
Estimation method for liquidus temperature of lead-free solder using differential scanning calorimetry profiles
-
Nishikawa, H., Hamada, Y. and Takemoto, T. (2009), “Estimation method for liquidus temperature of lead-free solder using differential scanning calorimetry profiles”, J. Electron. Mater., Vol. 38 No. 12, pp. 2610-6.
-
(2009)
J. Electron. Mater.
, vol.38
, Issue.12
, pp. 2610-2616
-
-
Nishikawa, H.1
Hamada, Y.2
Takemoto, T.3
-
23
-
-
14644396848
-
Solder joints for high temperature electronics
-
Nowottnick, M., Pape, U., Wittke, K. and Scheel, W. (2003), “Solder joints for high temperature electronics”, Proceedings of the SMTA International Conference, Chicago, IL, USA, pp. 693-9.
-
(2003)
Proceedings of the SMTA International Conference, Chicago, IL, USA
, pp. 693-699
-
-
Nowottnick, M.1
Pape, U.2
Wittke, K.3
Scheel, W.4
-
24
-
-
26444485487
-
Size effect on melting temperature of nanosolids
-
Qi, W.H. (2005), “Size effect on melting temperature of nanosolids”, Physica B, Vol. 368, pp. 46-50.
-
(2005)
Physica B
, vol.368
, pp. 46-50
-
-
Qi, W.H.1
-
25
-
-
0347355001
-
Dissolution kinetics of BGA Sn-Pb and Sn-Ag solders with Cu substrates during reflow
-
Sharif, A. and Chan, Y.C. (2004), “Dissolution kinetics of BGA Sn-Pb and Sn-Ag solders with Cu substrates during reflow”, Mater. Sci. Eng. B, Vol. 106, pp. 126-31.
-
(2004)
Mater. Sci. Eng. B
, vol.106
, pp. 126-131
-
-
Sharif, A.1
Chan, Y.C.2
-
26
-
-
60849092529
-
Research advances in nano-composite solders
-
Shen, J. and Chan, Y.C. (2009), “Research advances in nano-composite solders”, Microelectron. Reliab., Vol. 49 No. 3, pp. 223-34.
-
(2009)
Microelectron. Reliab.
, vol.49
, Issue.3
, pp. 223-234
-
-
Shen, J.1
Chan, Y.C.2
-
27
-
-
33748690770
-
Strengthening effects of ZrO2 nanoparticles on the microstructure and microhardness of Sn-3.5Ag lead-free solder
-
Shen, J., Liu, Y.C., Han, Y.J., Tian, Y.M. and Gao, H.X. (2006), “Strengthening effects of ZrO2 nanoparticles on the microstructure and microhardness of Sn-3.5Ag lead-free solder”, J. Electron. Mater., Vol. 35, pp. 1672-9.
-
(2006)
J. Electron. Mater.
, vol.35
, pp. 1672-1679
-
-
Shen, J.1
Liu, Y.C.2
Han, Y.J.3
Tian, Y.M.4
Gao, H.X.5
-
28
-
-
0032156161
-
Melting and freezing behaviour of embedded nanoparticles in ball-milled Al±10 wt% M (M=In, Sn, Bi, Cd, Pb) mixtures
-
Sheng, H.W., Lu, K. and Ma, E. (1998), “Melting and freezing behaviour of embedded nanoparticles in ball-milled Al±10 wt% M (M=In, Sn, Bi, Cd, Pb) mixtures”, Acta Mater., Vol. 46 No. 14, pp. 5195-205.
-
(1998)
Acta Mater.
, vol.46
, Issue.14
, pp. 5195-5205
-
-
Sheng, H.W.1
Lu, K.2
Ma, E.3
-
29
-
-
0031250797
-
Interfacial reactions in molten Sn/Cu and molten In/Cu couples
-
Su, L.H., Yen, Y.W., Lin, C.C. and Chen, S.W. (1997), “Interfacial reactions in molten Sn/Cu and molten In/Cu couples”, Metallurg. Mater. Trans. B, Vol. 28 No. 5, pp. 927-34.
-
(1997)
Metallurg. Mater. Trans. B
, vol.28
, Issue.5
, pp. 927-934
-
-
Su, L.H.1
Yen, Y.W.2
Lin, C.C.3
Chen, S.W.4
-
30
-
-
0041757124
-
The Cu-Mo (copper-molybdenum) system
-
Subramanian, P.R. and Laughlin, D.E. (1990), “The Cu-Mo (copper-molybdenum) system”, Journal of Phase Equilibria, Vol. 11 No. 2, pp. 169-72.
-
(1990)
Journal of Phase Equilibria
, vol.11
, Issue.2
, pp. 169-172
-
-
Subramanian, P.R.1
Laughlin, D.E.2
-
31
-
-
79960741635
-
Addition of cobalt nanoparticles into Sn-3.8Ag-0.7Cu lead-free solder by paste mixing
-
(accepted)
-
Tay, S.L., Haseeb, A.S.M.A. and Johan, M.R. (n.d.), “Addition of cobalt nanoparticles into Sn-3.8Ag-0.7Cu lead-free solder by paste mixing”, Solder. Surf. Mt. Tech., (accepted).
-
Solder. Surf. Mt. Tech.
-
-
Tay, S.L.1
Haseeb, A.S.M.A.2
Johan, M.R.3
-
32
-
-
67349083563
-
Effects of minor Fe, Co, and Ni additions on the reaction between SnAgCu solder and Cu
-
Wang, Y.W., Lin, Y.W., Tu, C.T. and Kao, C.R. (2009), “Effects of minor Fe, Co, and Ni additions on the reaction between SnAgCu solder and Cu”, J. Alloys Compd., Vol. 478, pp. 121-7.
-
(2009)
J. Alloys Compd.
, vol.478
, pp. 121-127
-
-
Wang, Y.W.1
Lin, Y.W.2
Tu, C.T.3
Kao, C.R.4
-
33
-
-
33745012896
-
Dissolution behavior of Cu and Ag substrates in molten solders
-
Yeh, P.Y., Song, J.M. and Lin, K.L. (2006), “Dissolution behavior of Cu and Ag substrates in molten solders”, J. Electron. Mater., Vol. 35 No. 5, pp. 978-87.
-
(2006)
J. Electron. Mater.
, vol.35
, Issue.5
, pp. 978-987
-
-
Yeh, P.Y.1
Song, J.M.2
Lin, K.L.3
-
34
-
-
37249046517
-
Investigation and dissolution behavior of metallic substrates and intermetallic compound in molten lead-free solders
-
Yen, Y.W., Chou, W.T., Tseng, Y., Lee, C. and Hsu, C.L. (2008), “Investigation and dissolution behavior of metallic substrates and intermetallic compound in molten lead-free solders”, J. Electron. Mater., Vol. 37 No. 1, pp. 73-83.
-
(2008)
J. Electron. Mater.
, vol.37
, Issue.1
, pp. 73-83
-
-
Yen, Y.W.1
Chou, W.T.2
Tseng, Y.3
Lee, C.4
Hsu, C.L.5
-
35
-
-
79958223410
-
Current crowding induced electromigration failure in flip chip technology
-
Yeth, E.C.C., Choi, W.J. and Tu, K.N. (2002), “Current crowding induced electromigration failure in flip chip technology”, Appl. Phys. Lett., Vol. 80, pp. 580-2.
-
(2002)
Appl. Phys. Lett.
, vol.80
, pp. 580-582
-
-
Yeth, E.C.C.1
Choi, W.J.2
Tu, K.N.3
-
36
-
-
13444252734
-
The formation of nano-Ag3Sn particles on the intermetallic compounds during wetting reaction
-
Yu, D.Q., Wang, L., Wu, C.M.L. and Law, C.M.T. (2005), “The formation of nano-Ag3Sn particles on the intermetallic compounds during wetting reaction”, J. Alloys Compd., Vol. 389, pp. 153-8.
-
(2005)
J. Alloys Compd.
, vol.389
, pp. 153-158
-
-
Yu, D.Q.1
Wang, L.2
Wu, C.M.L.3
Law, C.M.T.4
-
37
-
-
1642284116
-
-
Metallurgy Industry Press, Beijing
-
Zhai, Q.J., Guan, S.K. and Shang, Q.Y. (1999), Alloy Thermo-mechanism: Theory and Application, Metallurgy Industry Press, Beijing, pp. 156-60.
-
(1999)
Alloy Thermo-mechanism: Theory and Application
, pp. 156-160
-
-
Zhai, Q.J.1
Guan, S.K.2
Shang, Q.Y.3
|