Fine pitch Cu/Sn solid state diffusion bonding for advanced three-dimensional chip stacking

Japanese Journal of Applied Physics

Volumn 54, Issue 3, 2015, Pages

  Zhang, Wenqi ^a  

^a National Center for Advanced Packaging (NCAP China)   (China)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; DIFFUSION BONDING; DIFFUSION IN SOLIDS; ELECTRIC CONNECTORS; ELECTRONICS PACKAGING; TEMPERATURE;

ELECTRICAL CONNECTION; MECHANICAL CONNECTIONS; SOLID-STATE DIFFUSION; THREE DIMENSIONAL (3D) INTEGRATION; THREE DIMENSIONAL CHIP STACKING; THROUGH-SILICON-VIA (TSV); VERTICAL INTERCONNECTIONS; VERTICAL STACKING;

THREE DIMENSIONAL INTEGRATED CIRCUITS;

EID: 84924268690     PISSN: 00214922     EISSN: 13474065     Source Type: Journal    
DOI: 10.7567/JJAP.54.030203     Document Type: Article

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