Effect of oxidation on indium solderability

Journal of Electronic Materials

Volumn 37, Issue 4, 2008, Pages 483-489

  Kim, Jongman ^a   Schoeller, Harry ^b   Cho, Junghyun ^b   Park, Seungbae ^b  

^a Samsung Electro Mechanics   (South Korea)

^b State University of New York   (United States)

Author keywords

Indium; Indium oxide; Joint strength; Reflow

Indexed keywords

CHARACTERIZATION; GOLD; HEAT TREATMENT; MELTING; OXIDATION; SOLDERING; WETTING;

INDIUM OXIDE; JOINT STRENGTH; REFLOW;

INDIUM;

EID: 39849094891     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-007-0346-7     Document Type: Article

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