High density Cu-Sn TLP bonding for 3D integration

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2009, Pages 345-349

  Agarwal, Rahul ^a   Zhang, Wenqi ^a   Limaye, Paresh ^a   Ruythooren, Wouter ^a  

^a IMEC   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

3-D INTEGRATION; 3D DIE STACKING; DIE STACKING; HIGH DENSITY; HIGH-SPEED INTERCONNECTS; KEY TECHNOLOGIES; NO-FLOW UNDERFILL; THERMAL BUDGET; THROUGHPUT ENHANCEMENT; TLP BONDING; TRANSIENT LIQUID PHASE BONDING; VERTICAL INTERCONNECTIONS;

MELTING POINT; THREE DIMENSIONAL; TIN;

DIES;

EID: 70349666744     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2009.5074038     Document Type: Conference Paper

References (10)

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