Diamond Bit Cutting as Alternative to Polymer Patterning for 3D Interconnections Technologies

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2009, Pages 1284-1288

  Iker, F ^b   Funaya, T ^a   Teixeira, R C ^a   Ruythooren, W ^a  

^a IMEC   (Belgium)

^b NEC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CU-INTERCONNECTS; FABRICATION TECHNIQUE; INTERCONNECT STRUCTURES; LASER PATTERNING; PATTERNING TECHNIQUES;

PLASMA ETCHING;

OPTICAL INTERCONNECTS;

EID: 70349695845     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2009.5074176     Document Type: Conference Paper

References (5)

1. th international conference on microelectronics. Proceedings; 22-24 November 1999; Kuwait.
2. F. Iker, et al, "3D embedding and interconnection of ultra thin (< 20 μm) silicon dies.", EPTC 2007 p222-226.
3. K. Arai, et al., "A new planarization technique by high precision diamond cutting for packaging, ISSM 2004.
4. W. Ruythooren, et al., "Cu-Cu bonding alternative to solder based micro-bumping", EPTC 2007.
5. F. Iker, et al. "Technology platform for 3-D stacking of thinned embedded dies.", ECTC 2008, pp 292-298.