Scaling aspects of microjoints for 3D chip interconnects

ESSDERC 2006 - Proceedings of the 36th European Solid-State Device Research Conference

Volumn , Issue , 2006, Pages 262-265

  Munding, A ^a   Kaiser, A ^a   Benkart, P ^a   Kohn, E ^a   Heittmann, A ^b   Hubner H ^b   Ramacher, U ^b  

^a UNIVERSITY OF ULM   (Germany)

^b INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

HEAT TREATMENT; MELTING; NUCLEATION; SCALABILITY; WETTING;

COMBILAYERS; KINETIC CONTROLS; METAL BARRIERS; PHASE NUCLEATION;

MICROPROCESSOR CHIPS;

EID: 84943197472     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESSDER.2006.307688     Document Type: Conference Paper

References (7)

1. S. J. Ok, C. Kim, D. F. Baldwin, "High Density, High Aspect Ratio Through-Wafer Electrical Interconnect Vias for MEMS Packaging", IEEE Trans. Advanced Packaging, 26, 2003(3), 302-309.
2. P. Benkart, A. Kaiser, A. Munding et al., "3D Chip Stack Technology using Through-Chip Interconnects", IEEE Design & Test of Computers, 2005, Nov.-Dec., 2-8
3. L. Bernstein, H. Bartholomew, "Applications of Solid-Liquid Inter-diffusion (SLID) Bonding in Integrated-Circuit Fabrication", Transaction of the Metallurgical Society of AIME, 1966, 236, 405-412
4. H. Hübner, M. Eigner, W. Gruber et al., "Face-to-Face Chip Integration with Full Metal Interface", Proc. Advanced Metallisation Conference 2002 (AMC 2002), V18 , 53-58
5. S. Bader, W. Gust, H. Hieber, "Rapid formation of intermetallic Compounds interdiffusion in the Cu-Sn and Ni-Sn systems", Acta Metallurgica et Materialia, 1995, 43, 329-337
6. A. T. W. Kempen, "Solid State Phase Transformation Kinetics", Dissertation, Fakultät für Chemie, Universität Stuttgart, 2001
7. X. Deng, G. Piotrowski, J. J. Williams et al., "Influence of Initial Morphology and Thickness of Cu6Sn5 and Cu3Sn Intermetallics on Growth and Evolution during Thermal Aging of Sn-Ag Solder/Cu Joints", Journal of Electronic Materials, 2003, 32, 1403-1413