Study on Sn-Ag oxidation and feasibility of room temperature bonding of Sn-Ag-Cu solder

Materials Transactions

Volumn 46, Issue 11, 2005, Pages 2431-2436

  Wang, Ying Hui ^a   Howlader, Matiar R ^b,d   Nishida, Kenji ^c   Kimura, Takashi ^c   Suga, Tadatomo ^a,b  

^a UNIVERSITY OF TOKYO   (Japan)

^b UNIVERSITY OF TOKYO   (Japan)

^c NATIONAL INSTITUTE FOR MATERIALS SCIENCE   (Japan)

^d MCMASTER UNIVERSITY   (Canada)

Author keywords

Lead free solder; Oxidation; Room temperature bonding; Surface activated bonding; Tin silver alloy; Tin silver copper alloy

Indexed keywords

LEAD-FREE SOLDER; ROOM TEMPERATURE BONDING; SURFACE ACTIVATED BONDING; TIN-SILVER ALLOY;

CHEMICAL BONDS; MELTING; OXIDATION; THERMAL EFFECTS; TIN ALLOYS; X RAY PHOTOELECTRON SPECTROSCOPY;

SOLDERING ALLOYS;

EID: 30844432199     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.46.2431     Document Type: Article

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