Mass transport mechanism of Cu species at the metal/dielectric interfaces with a graphene barrier

ACS Nano

Volumn 8, Issue 12, 2014, Pages 12601-12611

  Zhao, Yuda ^a   Liu, Zhaojun ^b,c   Sun, Tieyu ^a   Zhang, Ling ^a   Jie, Wenjing ^a   Wang, Xinsheng ^a   Xie, Yizhu ^a   Tsang, Yuen Hong ^a   Long, Hui ^a   Chai, Yang ^a  

^a HONG KONG POLYTECHNIC UNIVERSITY   (Hong Kong)

^b SUN YAT SEN UNIVERSITY   (China)

^c SYSU CMU Shunde International Joint Research Institute   (China)

Author keywords

barrier; Cu interconnect; graphene; mass transport

Indexed keywords

CAPACITANCE; COPPER; CYCLIC VOLTAMMETRY; DENSITY FUNCTIONAL THEORY; DIELECTRIC MATERIALS; GRAPHENE; MASS SPECTROMETRY; MASS TRANSFER; SILICA; SOLID ELECTROLYTES; TANTALUM COMPOUNDS;

BARRIER; BIAS-TEMPERATURE STRESSING; CAPACITANCE VOLTAGE MEASUREMENTS; CU INTERCONNECT; ELECTROCHEMICAL REACTIONS; SOLID-STATE ELECTROLYTE; THEORETICAL CALCULATIONS; VOLTAMMETRY MEASUREMENTS;

NITROGEN COMPOUNDS;

EID: 84919725533     PISSN: 19360851     EISSN: 1936086X     Source Type: Journal    
DOI: 10.1021/nn5054987     Document Type: Article

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