Failure mechanisms of PVD Ta and ALD TaN barrier layers for Cu contact applications

Microelectronic Engineering

Volumn 84, Issue 11, 2007, Pages 2669-2674

  Zhao, C ^a   Tokei, Zs ^a   Haider, A ^a   Demuynck, S ^a  

^a IMEC   (Belgium)

Author keywords

ALD TaN; Backend interconnects; Cu contacts; Cu diffusion barrier; PVD Ta

Indexed keywords

COPPER; DIFFUSION BARRIERS; FAILURE ANALYSIS; PHYSICAL VAPOR DEPOSITION; POLYSILICON; TANTALUM COMPOUNDS; X RAY DIFFRACTION;

BACKEND INTERCONNECTS; BARRIER LAYERS; COMPATIBLE CHAMBERS; FAILURE MECHANISMS;

TANTALUM;

EID: 34548822674     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2007.05.061     Document Type: Article

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