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Volumn 86, Issue 24, 2005, Pages 1-3

Effects of electromigration-induced void dynamics on the evolution of electrical resistance in metallic interconnect lines

Author keywords

[No Author keywords available]

Indexed keywords

MASS TRANSPORT; METALLIC INTERCONNECT LINES; VOID DYNAMICS; VOID GROWTH;

COMPUTATIONAL METHODS; COMPUTER SIMULATION; CRYSTAL DEFECTS; ELECTRIC RESISTANCE; INTERCONNECTION NETWORKS; METALLIC FILMS; OSCILLATIONS; THIN FILMS;

ELECTROMIGRATION;

EID: 21344437495 PISSN: 00036951 EISSN: None Source Type: Journal
DOI: 10.1063/1.1947373 Document Type: Article

Times cited : (18)

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