High electromigration-resistant copper/carbon nanotube composite for interconnect application

Technical Digest - International Electron Devices Meeting, IEDM

Volumn , Issue , 2008, Pages

  Chai, Yang ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

INTERCONNECT APPLICATIONS; NANOTUBE COMPOSITES; TEST STRUCTURES;

COMPOSITE MICROMECHANICS; ELECTROMIGRATION;

ELECTRON DEVICES;

EID: 64549150487     PISSN: 01631918     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEDM.2008.4796764     Document Type: Conference Paper

References (11)

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