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Applied Physics Letters

Volumn 104, Issue 8, 2014, Pages

1-nm-thick graphene tri-layer as the ultimate copper diffusion barrier

(3) Nguyen, Ba Son a Lin, Jen Fin a Perng, Dung Ching a

a NATIONAL CHENG KUNG UNIVERSITY (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; DIFFUSION BARRIERS; GRAPHENE; HIGH RESOLUTION TRANSMISSION ELECTRON MICROSCOPY; NANOCRYSTALS;

CARBON STRUCTURES; COPPER DIFFUSION BARRIER; CU DIFFUSION BARRIER; CU INTERCONNECT; NANO-CRYSTALLINE STRUCTURES; RAMAN ANALYSIS; THERMALLY STABLE; TRANSMISSION ELECTRON MICROSCOPY IMAGES;

COPPER METALLOGRAPHY;

EID: 84896803311 PISSN: 00036951 EISSN: None Source Type: Journal
DOI: 10.1063/1.4866857 Document Type: Article

Times cited : (64)

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